Low Stress Adhesives for MEMS Packaging
DELO has developed a range of highly flexible adhesives that also offers high bond strength, a very unusual combination that has in the past proved extremely difficult to master.
What do MEMS Packaging Adhesives do?
MicroElectroMechanical Systems (MEMS) are found in a very wide variety of applications, from smart phones to military gyroscopes. These are usually measuring minute relative changes in the surrounding environment, so the adhesive used to bond the MEMS device to the substrate must be highly stress-relieving, in order that the adhesive itself doesn’t induce stress into the MEMS device.
A typical MEMS device consists of a MEMS IC + ASIC IC, both adhesive-bonded onto the substrate. The ASIC is then encapsulated, before the complete assembly is covered with a lid. These four separate applications require very different types of adhesives.
More detailed information on DELO’s range of die attach adhesives can be found here.
Adhesives Key Features
- Adhesive range developed for MEMS Packaging
- Low-stress die attach adhesive
- Highly flexible stress relieving epoxy
- High bond strength
- Short processing times
- Suitable for other low-stress adhesive applications
MEMS Packaging Adhesives Resources
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Adhesives for Microelectronic Packaging
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DELO-DOT PN5 Series Microdispensing Valves and Cleaning Station Brochure
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MEMS IC Adhesive
This is the most critical application, because the MEMS die must be as insulated as possible from the substrate to which it is bonded. The adhesive needs to have a high flexibility (Young’s Modulus ~ 5 MPa), high shear strength, and short processing time, for example curing at 100°C for 15 minutes, as most MEMS devices are manufactured in very high volumes.
The latest generation of MEMS die attach adhesive have all of these qualities, and in addition they have very low glass transition temperatures (Tg), which means that they do not stiffen until the ambient operating temperature drops to significantly below zero degrees Celsius, -65°C in this particular case.
ASIC IC Adhesive
Typical die attach adhesives are used for this, such as can be found here on the Die Attach Adhesives page. The adhesive should ideally be fast curing at low temperatures.
ASIC Encapsulation Adhesive
Typically this too will be a highly flexible adhesive. It should also be jettable, and have a fast processing time, for example, curing in 15 minutes at 100°C.
Lid Adhesive
This adhesive needs to have a very high impact resistance to protect the sensitive components in the MEMS package. As most lids are metal, the adhesive needs to bond well to gold, nickel, and stainless steel. It should also have a high electrical conductivity due to its EMC shielding requirement. DELO DUALBOND IC343 is a typical example of this type of adhesive.
Got a Question About MEMS Packaging Adhesives?
Whether you’re developing a new product or refining an existing process, Inseto’s team of experts is here to help.
From selecting the right adhesive to optimising your curing process, we provide technical guidance, documentation, and samples to support your application needs.
Knowledge Base Articles
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Adhesives for Die Attach (IKB-071)
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Die Attach Process: Guidance and Setup (IKB-072)
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Understanding Shear Test: Ball Bond and Die Shear (IKB-018)
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MIL STD 883 Shear Testing (IKB-026)
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Light Activated Adhesives (IKB-045)
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Basic Adhesive Types (IKB-041)
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How to Choose the Right Adhesive (IKB-035)
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All Things Considered (IKB-042)
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Related Products
Further Information
Applications
Bonding, Sealing, Encapsulation, Potting, Protection Against Vibration, Securing, Dam & Fill
Industry Segments
Microelectronic / Hybrid Assembly, Semiconductor Assembly / Back-end Assembly etc., Fibre Optics / Photonic Assembly, Microwave Electronics, OEM Equipment Manufacturers, Precision Components & Assemblies, PCB Assembly, Electronic Component / Device Assembly, Smart Cards, Smart Labels, RFID, Automotive Electronics etc.
Delo Website
Region
Available from Inseto in the United Kingdom & Ireland
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