Non-Conductive Die Attach Adhesive
DELO’s die attach adhesives have an extended working life, simplifying handling and processing, plus they meet an extensive range of customer requirements and specifications.
What do Non-Conductive Die Attach Adhesives do?
DELO manufactures a range of non-conductive die attach adhesives with excellent adhesion to a wide variety of substrates (FR4, gold-plated alumina, LCP, PETP, etc.). They are used in widely differing die bonding applications, including semiconductor assembly onto leadframes, microelectronic hybrid assembly onto alumina, commercial FR4 applications, etc.
Adhesives Key Features
- High purity non-conductive die attach adhesive
- Minimum out-gassing, epoxy adhesive base material
- Cure options include fast curing in seconds
- Optional light-fixing capability significantly reduces process times
- Added benefit of precise placement accuracy – elimination of movement during heat-cure
- Very low cure temperature of 60°C also available
Non-Conductive Die Attach Adhesives Resources
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Adhesives for Microelectronic Packaging
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Adhesives for Optical Transceivers
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Adhesives for PIC
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Light fixed, heat cured
Light-fixing the visible fillet of adhesive around the die takes as little as 1 second, and this ensures that there is no movement of the die between die placement and curing. Heat-curing is mandatory, and can take as little as 10 minutes at 100°C or 30 minutes at 80°C.
Got a Question About Non-Conductive Die Attach Adhesives?
Whether you’re developing a new product or refining an existing process, Inseto’s team of experts is here to help.
From selecting the right adhesive to optimising your curing process, we provide technical guidance, documentation, and samples to support your application needs.
Knowledge Base Articles
Description
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Adhesives for Die Attach (IKB-071)
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Die Attach Process: Guidance and Setup (IKB-072)
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Understanding Shear Test: Ball Bond and Die Shear (IKB-018)
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MIL STD 883 Shear Testing (IKB-026)
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Light Activated Adhesives (IKB-045)
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Basic Adhesive Types (IKB-041)
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How to Choose the Right Adhesive (IKB-035)
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All Things Considered (IKB-042)
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Related Products
Further Information
Applications
Bonding, Sealing, Encapsulation, Potting, Protection Against Vibration, Securing, Dam & Fill
Industry Segments
Microelectronic / Hybrid Assembly, Semiconductor Assembly / Back-end Assembly etc., Fibre Optics / Photonic Assembly, Microwave Electronics, OEM Equipment Manufacturers, Precision Components & Assemblies, PCB Assembly, Electronic Component / Device Assembly, Smart Cards, Smart Labels, RFID, Automotive Electronics etc.
Delo Website
Region
Available from Inseto in the United Kingdom & Ireland
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