Thermally Conductive Die Attach Adhesives
With excellent adhesion to a wide variety of substrates (FR4, LCP, ABS, etc.), DELO’s thermally conductive die attach adhesives meet an extensive range of customer requirements and specifications.
What do Thermally Conductive Die Attach Adhesives do?
Wherever thermal conductivity AND electrical isolation are required, DELO MONOPOX TC (thermally conductive) die attach adhesives are recommended. The adhesives are used in widely differing die bonding applications, including semiconductor assembly onto leadframes, microelectronic hybrid assembly onto alumina, commercial FR4 applications, etc.
More detailed information on DELO’s range of die attach adhesives can be found here.
DELO MONOPOX TC Key Features
- Aluminium nitride-filled epoxy for enhanced thermal conductivity
- High die shear strength
- Very low water absorption
- Semi-flexible for larger components
- Very low temperature curing for sensitive substrate materials
Thermally Conductive Die Attach Adhesives Resources
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Adhesives for Microelectronic Packaging
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Adhesives for Automotive Sensor Technology
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DELO-DOT PN5 Series Microdispensing Valves and Cleaning Station Brochure
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DELOLUX 20 Series Area Curing Lamps Brochure
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Withstands most thermal cycling requirements
With a low CTE value (22 ppm / °K) and a comparatively high elongation-at-tear (11%), DELO MONOPOX TC2270 adhesive will withstand most thermal cycling requirements. In addition, it meets the requirements of JEDEC MSL Level 1, resulting in an adhesive suitable for high reliability die attach applications. Some of these adhesives also continue to perform at Cryogenic temperatures (4°K).
Got a Question About Thermally Conductive Die Attach Adhesives?
Whether you’re developing a new product or refining an existing process, Inseto’s team of experts is here to help.
From selecting the right adhesive to optimising your curing process, we provide technical guidance, documentation, and samples to support your application needs.
Knowledge Base Articles
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Adhesives for Die Attach (IKB-071)
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Die Attach Process: Guidance and Setup (IKB-072)
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Understanding Shear Test: Ball Bond and Die Shear (IKB-018)
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MIL STD 883 Shear Testing (IKB-026)
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Light Activated Adhesives (IKB-045)
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Basic Adhesive Types (IKB-041)
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How to Choose the Right Adhesive (IKB-035)
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All Things Considered (IKB-042)
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Related Products
Further Information
Applications
Bonding, Sealing, Encapsulation, Potting, Protection Against Vibration, Securing, Dam & Fill
Industry Segments
Microelectronic / Hybrid Assembly, Semiconductor Assembly / Back-end Assembly etc., Fibre Optics / Photonic Assembly, Microwave Electronics, OEM Equipment Manufacturers, Precision Components & Assemblies, PCB Assembly, Electronic Component / Device Assembly, Smart Cards, Smart Labels, RFID, Automotive Electronics etc.
Delo Website
Region
Available from Inseto in the United Kingdom & Ireland
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