RF and Microwave Packages

Egide designs and manufactures a wide variety of RF packages for various markets. Frequency capabilities range from S-band all the way up the spectrum to V-band.

Its state-of-the-art RF simulation capability, combined with in-house ceramic technology and assembly processes, ensures that the most demanding applications are met for hermeticity, high frequency, and thermal management. Egide’s dedicated Field Application Engineers work directly with customers to ensure that the fully assembled device meets all customers requirements. File sharing using HFSS and SolidWorks ensure that the package designed in collaboration with customers, and manufactured at Egide, performs as required in the relevant frequency band(s).

RF designs can use either Kovar^TM or aluminium materials as standard, combined with high-temperature co-fired (HTCC) alumina manufactured at Egide. In-house electroless and electrolytic plating complete the assembly, ensuring total process control within Egide.

HTCC for RF and Microwave Applications

HTCC technology is well suited to RF and microwave packaging where high‑frequency performance, hermeticity and long‑term reliability are critical.

The technology enables multilayer ceramic structures with integrated vias and ground planes, supporting controlled impedance routing and high‑density interconnects that help maintain signal integrity at RF and microwave frequencies. This capability supports advanced RF transition designs from S‑band through to V‑band, with development capability extending towards higher frequencies.

HTCC also offers excellent mechanical strength, thermal stability and hermetic performance, making it suitable for harsh operating environments involving temperature extremes and long service life. Egide’s in‑house HTCC manufacturing ensures full control of ceramic processing and assembly, enabling RF and microwave packages to be optimised for specific frequency, thermal and application requirements.