RF and Microwave Packages
Egide designs and manufactures a wide variety of RF packages for various markets. Frequency capabilities range from S-band all the way up the spectrum to V-band.
What are RF and Microwave Packages?
RF and microwave hermetic packages are precision‑engineered enclosures designed to house high‑frequency electronic devices operating across RF and microwave bands. They provide a hermetically sealed environment that protects sensitive components while maintaining signal integrity, electrical performance and thermal stability at high frequencies.
Key Features of RF and Microwave Packages
- World leader in high frequency & RF transition technology
- Dedicated customer-facing Field Application Engineering department
- Target of 100 GHz capability currently under development
- In-house ceramic (HTCC) capability
Egide RF Simulation Capability
Egide’s state-of-the-art RF simulation capability, combined with in-house ceramic technology and assembly processes, ensures that the most demanding applications are met for hermeticity, high frequency, and thermal management. Egide’s dedicated Field Application Engineers work directly with customers to ensure that the fully assembled device meets all customers requirements. File sharing using HFSS and SolidWorks ensure that the package designed in collaboration with customers, and manufactured at Egide, performs as required in the relevant frequency band(s).
RF designs can use either KovarTM or aluminium materials as standard, combined with high-temperature co-fired (HTCC) alumina manufactured at Egide. In-house electroless and electrolytic plating complete the assembly, ensuring total process control within Egide.
HTCC for RF and Microwave Applications
HTCC technology is well suited to RF and microwave packaging where high‑frequency performance, hermeticity and long‑term reliability are critical.
The technology enables multilayer ceramic structures with integrated vias and ground planes, supporting controlled impedance routing and high‑density interconnects that help maintain signal integrity at RF and microwave frequencies. This capability supports advanced RF transition designs from S‑band through to V‑band, with development capability extending towards higher frequencies.
HTCC also offers excellent mechanical strength, thermal stability and hermetic performance, making it suitable for harsh operating environments involving temperature extremes and long service life. Egide’s in‑house HTCC manufacturing ensures full control of ceramic processing and assembly, enabling RF and microwave packages to be optimised for specific frequency, thermal and application requirements.
Key Characteristics of RF and Microwave Packages
- Designed to support RF and microwave operation from S‑band through to V‑band frequencies.
- Integrated ceramic‑to‑metal sealing technologies to protect devices from moisture and environmental contamination.
- Engineered to manage heat effectively while maintaining electrical stability at high frequencies.
- Developed in collaboration with customers using in‑house RF simulation
Got a Question About RF and Microwave Packages?
Whether you’re developing a new product or refining an existing process, Inseto’s team of experts is here to help.
From selecting the right hermetic power package to optimising your processes, we provide technical guidance, documentation, samples and on-site training to support your application needs.
Knowledge Base Articles
Related Products
Further Information
Wiki – Semiconductor Device Fabrication
Applications
High Reliability Hermetic Packages, Microelectronic Hybrid Housings, Power Semiconductor Assemblies, Microwave Assemblies, Optical Packages, Thermal Imaging Sensors etc.
Industry Segments
Wireless, Internet Infrastructure, Military, Aerospace, Industrial, Telecommunications, Fibre Optics / Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly etc.
Egide Website
Region
Available from Inseto in the United Kingdom, Ireland & Nordic Region
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