MPP Bonding Wedge Tool Nomenclature
Bonding Wedge Tool Nomenclature: This article explains the nomenclature used to identify Micro Point Pro’s bonding tools for wire and ribbon bonding (IKB-010).
Bonding wedge tool selection is key to a successful and stable wire bond process. Bonding tools are high precision manufactured, with attributes specific to the wire diameter in use and bonding process parameters.
Bonding wedge tools are manufactured from three main materials:
- Tungsten Carbide for aluminium wire
- Titanium Carbide for gold wire
- Ceramic tipped tungsten carbide tools are also available for gold processes
The figure below describes the Micro Point Pro round wedge nomenclature:
Three main selection criteria for the above bond wedges are:
Hole Diameter (H):
This contributes to bond placement accuracy and wire clearance during looping.
Hole Angle (Ha):
This contributes to looping consistency, heel stress in the bonds and tailing consistency.
Bond Length (BL):
Directly affects 1st / 2nd bond size, wire pull strength.
View the range of “Bonding Wedge Tools“.
View the range of “Coining Wire Bonding Materials“.
View the range of “MPP Equipment for Wire Bonding“.
View the range of “K&S Automatic Wire Bonders“.
Author
Date
Version
Author
Jim Rhodes
Date
11 August 2017
Version
IKB010 Rev. 1
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