Manual & Semi-Automatic Wafer Mount Equipment
ADT manufacture manual and semi-automatic wafer mount equipment for bubble free adhering of wafers or devices to UV or standard blue tapes. Models include:
Manual Wafer Mount Equipment
The 966 Manual Wafer Mount System from ADT is a small footprint system for bubble-free mounting onto standard or UV tapes.
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Semi-Automatic Wafer Mount Equipment
The 967 Semiautomatic Wafer Mount System is a small footprint machine for automatic bubble free mounting of wafers.
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ADT – Advanced Dicing Technologies
See the full ADT Dicing Equipment product range
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Further Information
What is a Wafer Mounter?
A wafer mounter attaches semiconductor wafers to dicing tape on a film frame or ring before singulation. This stabilizes the wafer to prevent movement during the cutting process and holds the individual die in-place, until further processing.
Manual wafer mounters provide flexibility for different sized substrates and smaller batch sizes, whilst semi‑automatic models add recipe control and automated processes for speed and improved consistency. The key benefits of a wafer mounter are:
- Protects fragile wafers by stabilizing them during handling and dicing.
- Delivers bubble-free, uniform mounting for improved die quality.
- Enhances dicing accuracy and yield, reducing defects and edge chipping.
- Supports automated die picking, improving throughput and reducing manual errors.
- Reduces tape usage and operating costs, especially with semi-automatic systems.
Wiki – Die Singulation
Applications
MEMS Packaging, Camera Module Fabrication, Memory, FO WLP, Flip Chip Bumping, BGA Solder Ball Placement, Smart phones and Tablet CSP Packaging, Bio Medical Device Assembly, Sub Contract Wafer Dicing, Sub Contract Wafer Bumping, Sub Contract Solder Bumping
Industry Segments
Semiconductor Fabrication, Photonics, Bio Medical, Consumer Electronics, Aerospace, Defence
Visit the ADT Website
Region
Available from Inseto in the United Kingdom, Ireland & Scandinavia
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