Manual & Semiautomatic Dicing Saw
Advanced Dicing Technologies Ltd. (ADT) is a leading dicing saw manufacturer, developing and producing dicing saws and related equipment used worldwide to dice and scribe semiconductor wafers and other hard material’s, including glass, ceramic substrates, ferrite, MEMS and for package singulation.
ADT produces an extensive range of manually through semi and fully automatic dicing equipment to suit a wide range of application requirements, from semiconductor research and development, through to medium and high volume production applications.
Systems are used for precision cutting of glass, sapphire and ceramic components from 50mm diameter, through 300mm silicon and compound semiconductor wafers. A large area system enables substrates and panels up to 450x600mm to be diced or scribed.
With high power machines for cutting thicker and harder materials, single or dual spindle configurations and spindles mounted either perpendicular or tilted to the samples being cut, ADT offer the most comprehensive range of manual and semi-automatic dicing saw’s, models include:
Semiautomatic Dicing Saw
ADT’s 7120 Series of Semiautomatic Dicing Systems for 50-200mm devices, cover the full spectrum of dicing materials.
More
Large Area Dicing Systems
ADT produce a range of high-precision large area dicing systems for up to 450x600mm devices.
More
Dual Spindle Semi-Automatic Dicing Saw 7900
The 7900 Duo system provides a perfect solution for applications that require a long cut cycle time.
More
ADT – Advanced Dicing Technologies
See the full ADT Dicing Equipment product range
More
Further Information
What is a Wafer Dicing Saw?
A wafer dicing saw is a precision tool used in semiconductor fabrication, which accurately separates patterned wafers into individual chips (dies) prior to packaging. Traditional systems use diamond blades rotating at high speeds to cut in the spaces (streets) between the dies. Alternative methods, such as laser or plasma dicing, are sometimes used to process specific materials and very thin wafers.
Key Components of a Diamond Dicing Saw:
- Spindle and Blade: Precisely rotates the blade at high speed for wafer separation.
- Chuck: Holds the wafer securely during the cutting process.
- X-Y Stage: Moves the wafer under the diamond blade for accurate cutting paths.
- Vision Alignment: Aligns wafer streets with the blade for precision.
- Coolant System: Delivers fluid to cool the blade and reduce contamination.
- Control Interface: Allows operators to set parameters and monitor cutting.
Inseto Knowledge Base Document:
Read our guide to the “Dicing Blade Selection“
Wiki – Die Singulation
Applications
Dicing of Semiconductor Wafer, Cutting Hard Materials, Cutting Precision Metal Parts, Dicing Thin Film Substrates, Cutting Ferrites, Scribing & Dicing Ceramic Components, Cutting Glass & Glass Filters, Dicing MEMS, Package Singulation etc., PCB Assembly Industries, Universities Wafer Processing, Passive Component Manufacturing, Separating Medical Devices.
Industry Segments
Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Fibre Optics / Photonics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices, Glass Device Processing.
ADT Website
Region
ADT’s dicing equipment is available from Inseto in the United Kingdom, Ireland & Nordic Region: Denmark, Sweden, Finland and Norway
Request Form
Back to top