Dual Spindle Semiautomatic Dicing Series 7900Duo
7900 Key Features
- Advanced dual spindle wafer dicing system
- Models for up to 200x200mm or 250x250mm devices
- Quick alignment function for broken or partial wafers
- Low vibration spindles enable superb cut quality
- Small footprint & low cost of ownership
The 7900 Series – Taking your productivity to the edge.
As part of the growing market to dice small discrete devices and the on-going demand to lower the cost of production per unit, ADT has responded with a dual spindle system model 7900 Duo that double the productivity while maintaining the same current production floor space.
The 7900 Duo system provides a perfect solution for applications that require a long cut cycle time such as image sensors and saw devices.
Further to the automatic vision and easy Graphic User Interface (GUI), ADT is offering a unique feature for processing and programming of broken wafers.
7900 Series Advantages:
- Two facing spindles enable simultaneous dicing
- Low vibration platform
- Fast automatic alignment and cut positioning increase throughput
- Small footprint reduces cost of ownership
- Automatic Kerf inspection increase yield
- Automatic Y offset correction ensures maximum precision
- Tape surface detection ensures consistent cut quality
- Touch screen user interface
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Knowledge Base Articles
Further Information
What is a Dual Spindle Wafer Dicing Saw?
A dual spindle wafer dicing system is an advanced cutting solution used in semiconductor manufacturing that features two air bearing spindles, each equipped with a diamond blade. This configuration allows the system to perform two different cuts in a single setup, such as rough cutting and fine cutting, without the need to change blades or interrupt the process.
Dual spindle wafer dicing systems deliver superior efficiency, making them ideal for separation of ultra-small semiconductor devices, such as LED’s and high-volume production runs.
Benefits of a Dual-Spindle Dicing Saw:
- Quicker Setup: Eliminates the need for blade changes between different cuts.
- Improved Productivity: Enables simultaneous or sequential cutting operations.
- Accuracy: Maintains alignment between cuts, ensuring consistent die quality.
- Cost Efficiency: Minimizes downtime and optimizes machine utilization.
- Ideal for Complex Processes: Enables multiple cut depths or different blades types.
Inseto Knowledge Base Document:
Read our guide to the “Dicing Blade Selection“
Wiki – Die Singulation
Applications
LED wafer dicing, Dicing Semiconductor Wafers, Cutting Hard Materials, Cutting Precision Metal Parts, Dicing Thin Film Substrates, Cutting Ferrites, Scribing & Dicing Ceramic Components, Cutting Glass & Glass Filters, Dicing MEMS, Package Separation etc., PCB Dicing, Passive Component and Green Ceramic Dicing.
Industry Segments
LED, Laser, Diode, Semiconductor Production, University Research, Military & Aerospace, Telecommunications, Medical Electronics, Fibre Optics and Photonics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries.
ADT Website
Region
ADT’s dicing equipment is available from Inseto in the United Kingdom, Ireland & Nordic Region: Denmark, Sweden, Finland and Norway
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