Semiautomatic Dicing Saw 7120 / 7130 Series
Semiautomatic Dicing Saw 7120/7130 Series:
- Available with either 2″ and 4″ dicing spindles
- Advanced automatic vision alignment capabilities
- Designed for high reliability and low maintenance
- Precision structure for superior accuracy and repeat-ability
- Increased yield, throughput and process control
- Unique multi-panel processing capabilities
- Special blade wear forecast algorithm
- User-friendly software platform
ADT’s 7120/7130 Series of Semiautomatic Dicing Saw’s for 50-300mm devices, cover the full spectrum of dicing materials from semiconductor wafers to PCB packages, glass and ceramics etc.
Featuring high-precision air bearing spindles, close loop wafer stages, user friendly software, advanced vision and real-time process monitoring, the systems deliver the optimum in quality, reliability and performance.
The series offer the lowest possible cost-of-ownership, whilst providing the most advanced dicing technology, with models optimised for specific applications.
ADT’s 7120/7130 series of semiautomatic dicing saw models include:
7122 Semiautomatic Dicing Saw – for dicing thin materials such as semiconductor wafers up to 200mm diameter or PCB panels up to 200mm x 200mm square.
7124 Semiautomatic Dicing Saw – for dicing thick and hard materials such as glass, optical filters and ceramics up to 200mm diameter or 200 x 200mm square.
7132 Semiautomatic Dicing Saw – for dicing thin materials such as semiconductor wafers up to 300mm diameter or PCB panels up to 300mm x 225mm square.
7134 Semiautomatic Dicing Saw – for dicing thick and hard materials such as glass, optical filters and ceramics up to 300mm diameter or 300 x 225mm square.
Semiautomatic Dicing Saw 7120/7130 Series Downloads:
File
7120-30 Series Dicing Systems
Download
File
Principles of Dicing
Download
Example Applications
Wafer Dicing
Compound Wafer Dicing
LTCC Dicing
Package Singulation
PZT Dicing
Related Products
Manual & Semiautomatic Wafer Mounters
More
Peripheral Dicing Equipment
More
Hubbed Dicing Blades
More
Hubless Annular Dicing Blades
More
Semiconductor Wafers
More
Knowledge Base Articles
Further Information
What is a Semiautomatic Wafer Dicing Saw?
A semiautomatic wafer dicing saw is a precision cutting system used in semiconductor fabrication to separate patterned wafers into individual chips (dies) before packaging. These systems combine operator loading and unloading of the wafer, with automated features for enhanced accuracy and efficiency.
Key Components of a Semiautomatic Wafer Dicing Saw:
- Spindle and Diamond Blade: Precisely rotates the cutting blade at high speeds.
- Chuck: Holds the wafer securely during the cutting process.
- X-Y Stage: Moves the wafer under the diamond blade for accurate cutting paths.
- Vision Alignment: Aligns wafer streets with the blade for precision.
- Coolant System: Delivers fluid to cool the blade and reduce contamination.
- Control Interface: Allows operators to set parameters and monitor cutting.
- Safety Enclosure: Protects the operator and maintains a clean cutting environment.
Inseto Knowledge Base Document:
Read our guide to the “Dicing Blade Selection“
Wiki – Die Singulation
Applications
Semiautomatic Dicing Semiconductor Wafers and Cutting Hard Materials, Cutting Precision Metal Parts, Dicing Thin Film Substrates, Cutting Ferrites, Scribing & Dicing Ceramic Components, Cutting Glass & Glass Filters, Dicing MEMS, Package Singulation etc., PCB Assembly Industries, Universities Wafer Processing, Passive Component Manufacturing, Separating Medical Devices, Glass Device Processing
Industry Segments
Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Fibre Optics / Photonics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices, Glass Device Processing.
ADT Website
Region
ADT’s wafer dicing equipment is available from Inseto in the United Kingdom, Ireland & Nordic Region: Denmark, Sweden, Finland and Norway
Request Form
Back to top