Semiautomatic Large Area Dicing Systems
7120/7130 Series Key Features
- Series of large dicing systems for up to 450 x 600mm devices
- Unique multi-panel processing capabilities
- Advanced hardware platform for high reliability & low maintenance
- High & low power Spindle options
- Customized chucks configurations
- Increased theta precision for high accuracy over long cut lengths
- Spacious load & unload area for large substrates
ADT produce a range of high-precision large area dicing systems for processing up to 300mm (12″) wafers, in addition to the cutting of large PCB substrates or hard and brittle glass and ceramic substrates. Whilst the 7100XLA model can handle even larger substrates, PCB and other devices up to 450 x 600mm in size. All systems are available with either 2″ or 4″ spindles.
For cutting hard and thick materials, the systems include high power 4″, DC-brushless, 2.5 kW, Air-bearing Spindles (30,000 rpm Max.), with closed-loop turntable. These are optimised for high-precision, multi-panel dicing of thick applications up to 450 mm x 600 mm panels etc.
For processing up to 300mm silicon wafers, the systems feature front mount 2″ air bearing spindles for up to 1.2KW at 60krpm. A DC Brushless motor provides close-loop speed control. These models are compatible with 2″ – 3″ hub and annular blades.
7120/7130 Large Area Dicer Technical Downloads
File
7120-30 Series Dicing Systems
Download
File
Principles of Dicing
Download
Related Products
Manual & Semiautomatic Wafer Mounters
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Peripheral Dicing Equipment
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Hubbed Dicing Blades
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Hubless Annular Dicing Blades
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Semiconductor Wafers
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Knowledge Base Articles
Further Information
What is a Wafer Dicing Saw?
A wafer dicing saw is a precision tool used in semiconductor fabrication, which accurately separates patterned wafers into individual chips (dies) prior to packaging. Traditional systems use diamond blades rotating at high speeds to cut in the spaces (streets) between the dies. Alternative methods, such as laser or plasma dicing, are sometimes used to process specific materials and very thin wafers.
Key Components of a Diamond Dicing Saw:
- Spindle and Blade: Precisely rotates the blade at high speed for wafer separation.
- Chuck: Holds the wafer securely during the cutting process.
- X-Y Stage: Moves the wafer under the diamond blade for accurate cutting paths.
- Vision Alignment: Aligns wafer streets with the blade for precision.
- Coolant System: Delivers fluid to cool the blade and reduce contamination.
- Control Interface: Allows operators to set parameters and monitor cutting.
Inseto Knowledge Base Document:
Read our guide to the “Dicing Blade Selection“
Wiki – Die Singulation
Applications
Dicing Semiconductor Large Wafers or Panels. Cutting Hard Materials, Cutting Precision Metal Parts, Dicing Thin Film Substrates, Cutting Ferrites, Scribing & Dicing Ceramic Components, Cutting Glass & Glass Filters, Dicing MEMS, Package Separation etc., PCB Dicing, Passive Component and Green Ceramic Dicing.
Industry Segments
Semiconductor Production, University Research, Military & Aerospace, Telecommunications, Medical Electronics, Fibre Optics and Photonics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries.
ADT Website
Region
ADT’s dicing equipment is available from Inseto in the United Kingdom, Ireland & Nordic Region: Denmark, Sweden, Finland and Norway
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