967 Semi-Automatic Wafer Mounter
967 Semi-Automatic Wafer Mounter Key Features
- Automatic mounting process with hands free operation
- Minimal footprint – Tabletop design
- Operator friendly; quick and simple to use and maintain
- Minimal tape usage
- Fast, accurate, bubble free wafer mounting
- Mounts up to 120 wafers per hour
- Adjustable roller pressure
- Compatible to all dicing tapes and frames (Up to 200 or 300mm)
The 967 Semiautomatic Wafer Mounter from ADT is a small footprint user friendly system for automatic bubble free mounting up to 200mm (967) or 300mm (967L) wafers, onto either standard blue or UV tapes.
The 967 provides fast, accurate mounting, avoiding the risks associated with manual systems. Once set, the same sequence is used for each wafer, thus ensuring high quality and consistent results. Process parameters, such as Roller pressure, Chuck temperature and Mounting speed, can easily be set using the user-friendly interface.
The 967 Wafer Mounter is also designed to minimise or reduce mounting costs, using all standard dicing tapes (pre-cut tape is not required), lowering the tape usage by as much as 25% compared to manual mounting. The low air and power consumption makes the 967 very economic.
967 Semi-Automatic Wafer Mounter Technical Downloads
File
ADT 967 Semi-Automatic Wafer Mounter Datasheet
Download
File
Principles of Dicing
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ADT 967 Semi-Automatic Wafer Mounter Specifications
Supported tapes:
Dicing blue tapes / UV tapes
Supported frames:
DTF 2-8-1; DTF 2-6-1; 350-103; 350-104
Supported wafers:
Up to 200mm or 300mm diameter
Mounting time:
< 30 seconds
Dimensions (WxDxH):
967: 655 x 590 x 560 mm, 976L: 791 x 706 x 557 mm
Temp Controlled Chuck heater:
Up to 65 °C
Backing tape collector:
Backing tape collecting mechanism for UV tape
Roller Pressure:
1-6 bar
Optional Custom chucks:
Non Contact, rectangular frame & custom chucks
ESD:
Electro-static eliminator option
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Knowledge Base Articles
Further Information
What is a Wafer Mounter?
A wafer mounter attaches semiconductor wafers to dicing tape on a film frame or ring before singulation. This stabilizes the wafer to prevent movement during the cutting process and holds the individual die in-place, until further processing.
Manual wafer mounters provide flexibility for different sized substrates and smaller batch sizes, whilst semi‑automatic models add recipe control and automated processes for speed and improved consistency. The key benefits of a wafer mounter are:
- Protects fragile wafers by stabilizing them during handling and dicing.
- Delivers bubble-free, uniform mounting for improved die quality.
- Enhances dicing accuracy and yield, reducing defects and edge chipping.
- Supports automated die picking, improving throughput and reducing manual errors.
- Reduces tape usage and operating costs, especially with semiautomatic systems.
Wiki – Die Singulation
Applications
Dicing Semiconductor Wafers and Cutting Hard Materials, Cutting Precision Metal Parts, Dicing Thin Film Substrates, Cutting Ferrites, Scribing & Dicing Ceramic Components, Cutting Glass & Glass Filters, Dicing MEMS, Package Singulation etc., PCB Assembly Industries, Universities Wafer Processing, Passive Component Manufacturing, Separating Medical Devices
Industry Segments
Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Fibre Optics / Photonics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices, Glass Device Processing
ADT Website
Region
Available from Inseto in the United Kingdom, Ireland & Scandinavia
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