966 Manual Wafer Mounter
966 Key Features
- Versions for up to 200mm and 300mm wafers
- Chuck dependant, process round or square substrates & panels
- Uniform mounting without air bubbles
- Compatible with UV or regular tapes
- Built-in reeling and removal of UV tape backing
- Engraved chuck markings aid substrate alignment
- Compatibility with all film frames; linear & circular tape cutting
The 966 Manual Wafer Mount System from ADT is a small footprint machine for bubble-free mounting wafers or other substrates onto standard or UV tapes.
Model dependant, work-pieces up 200mm (966) or 300mm (966L) are quickly and easily processed. Where UV tape is used, backing tape is automatically re-spooled.
The system incorporates a configurable wafer chuck with optional soft contact materials for thin or fragile wafers, plus a non-contact mode for sensitive wafers. Other chucks are available for multi-panel or custom requirements.
Compatible with all frame types, an array of engraved chuck markings simplifies work-piece to frame alignment and where metallic frames are used, magnets hold the frame in-place during operation.
Features include:
- Handles wafers up to 200mm or 300mm
- Compact, table-top design
- Controlled- temperature platen
- Built-in vacuum generator
- Uniform tape tensioning
- Adjustable Spring-Loaded Platen
- Custom chucks
- UV tape liner removal
- Bubble free Mounting
- Optional non-contact mode
966 Manual Wafer Mounter Technical Downloads
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ADT 966 Manual Wafer Mounter
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Principles of Dicing
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966 – 200mm Wafer Mounter Specifications
Max. wafer size:
Ø 200 mm*
Max. tape width:
300 mm
Plate heating:
Up to 80°C
Dimensions (WxDxH):
304 x 800 x 394 mm
Approx. weight:
30 kg
966L – 300mm Wafer Mounter Specifications
Max. wafer size:
Ø 300 mm*
Max. tape width:
400 mm
Plate heating:
Up to 80°C
Dimensions (WxDxH):
330 x 1000 x 560 mm
Approx. weight:
60 kg
*Refers to standard models
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Knowledge Base Articles
Further Information
What is a Wafer Mounter?
A wafer mounter attaches semiconductor wafers to dicing tape on a film frame or ring before singulation. This stabilizes the wafer to prevent movement during the cutting process and holds the individual die in-place, until further processing.
Manual wafer mounters provide flexibility for different sized substrates and smaller batch sizes, whilst semi‑automatic models add recipe control and automated processes for speed and improved consistency. The key benefits of a wafer mounter are:
- Protects fragile wafers by stabilizing them during handling and dicing.
- Delivers bubble-free, uniform mounting for improved die quality.
- Enhances dicing accuracy and yield, reducing defects and edge chipping.
- Supports automated die picking, improving throughput and reducing manual errors.
- Reduces tape usage and operating costs, especially with semiautomatic systems.
Wiki – Die Singulation
Applications
Dicing Semiconductor Wafers and Cutting Hard Materials, Cutting Precision Metal Parts, Dicing Thin Film Substrates, Cutting Ferrites, Scribing & Dicing Ceramic Components, Cutting Glass & Glass Filters, Dicing MEMS, Package Singulation etc., PCB Assembly Industries, Universities Wafer Processing, Passive Component Manufacturing, Separating Medical Devices
Industry Segments
Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Fibre Optics / Photonics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices, Glass Device Processing
ADT Website
Region
Available from Inseto in the United Kingdom, Ireland & Scandinavia
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