AV-57L UV Dicing Tape Curing Systems
AV-57L UV Key Features:
- Fast curing, achieves superior results in just 5 seconds
- Compact tabletop space saving design
- Touchscreen controls with real time monitoring
- 400 x 400 mm process area for up to 300mm wafer frames
- Easy maintenance and trouble-free operation
- Compliant to the highest safety standards
The AV-57L UV LED Tape Curing Systems reduce the adhesive strength of all UV-sensitive dicing tapes in a controlled environment. Featuring advanced LEDs emitting a precise 365 nm light wave, ADT’s dicing tape curing systems offer unmatched efficiencies and curing speeds for the most demanding applications.
Developed for table-top use in manual applications, the system incorporates touch screen interface with real-time monitoring. With LED intensity controllable between 0%-100%, the systems can achieve superior results in just 5 seconds.
Elegant in design, the AV-57L systems are environmentally friendly, comply with the highest safety standards and require minimal maintenance, making them the ideal choice for single wafer processing.
Features and options include:
- Emergency Stop Button: Instantly cuts power for safety
- Drawer sensor: Automatically halts operation if opened
- Separate work area: Keeps electronics isolated for added safety
- Fast curing: Achieves superior results in just 5seconds
- Programmable controls for tailored efficiency
- Manual or automatic stop options for flexibility
- Light tower & buzzer for clear alerts
- Nitrogen Kit: Removes Oxygen for optimal curing
- Frame Shutter Kit: Protects the frame from UV radiation
AV-57L UV Dicing Tape Curing Systems Downloads
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AV-57L UV Dicing Tape Curing System
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File
Principles of Dicing
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AV-57L – UV Dicing Tape Curing System Specifications
Max. wafer frame size:
300 mm (12″)
Effective UV wavelength:
365 nm
Throughput:
5 seconds per frame (application dependent)
Dimensions (WxDxH):
500 x 550 x 400 mm (drawer closed) – 500 x 1100 x 400 mm (drawer open)
Weight:
56 kg
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Further Information
Applications
ADT UV Dicing Tape Curing Systems reduce the adhesive strength of all UV-sensitive dicing tapes under controlled environment.
Industry Segments
Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Fibre Optics / Photonics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices, Glass Device Processing
ADT Website
Region
Available from Inseto in the United Kingdom, Ireland & Scandinavia
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