Vacuum Process Ovens: VPO-300
RPO300 Key Features
- High Performance Vacuum Process Oven
- For RTP/RTA and high temperature applications
- Precise ramp up and ramp down rates
- Excellent temperature uniformity (<1% of set temperature)
- 3 programmable heating zones
- Data logging integrated as standard
- 50 programs with 50 steps
- Small footprint
A vacuum process oven for wafers or substrates up to 300 mm in diameter. This rapid thermal processing solution is an automatic vertical opening oven for the quick annealing of large diameter substrates. This single wafer system is capable of ramping up to 1200°C at rates up to 40K/s.
The VPO-300 is designed for annealing at high temperatures for a short period of time. The aluminum process chamber with quartz bottom plate is heated by top and bottom, cross-aligned IR lamps. As with the smaller RTP solutions from UniTemp the temperature control is by contact thermocouple. Vacuum levels of 10e-6 hPa are achievable using the external pump system. Up to 4 process gases controlled by mass flow controller (MFC) including Oxygen, Nitrogen, Hydrogen and forming gas.
A small footprint, large wafer format thermal processing solution, the VPO-300 is designed for the following applications: prototype research; quality control; annealing; SiAu, SiAl, SiMo alloying; low k dielectrics; post implanting annealing.
The process control via 7” touch panel allows via the intuitive SPS SIMATIC controller the quick and simple programming of recipes and temperature profiles. Software allows the permanent monitoring, read-out and analysis of process gas flow, pressure, temperature and cooling water status.
Technical Downloads
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VPO-300, VPO-300-HV (High Vacuum)
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Further Information
What Benefit Does Vacuum Add to RTP / RTA Processes?
Adding vacuum to RTP and RTA processes improves process cleanliness, control, and repeatability by removing oxygen and other reactive gases from the chamber, preventing unwanted oxidation, surface contamination, and interface degradation during high temperature processing.
A vacuum environment also reduces convective heat transfer effects and allows precise control of the process atmosphere when introducing inert or reactive gases, making vacuum RTP and RTA particularly well suited to annealing, alloying, dopant activation, and post implantation treatments where low thermal budget, clean surfaces, and consistent results are critical.
Key benefits of vacuum RTP / RTA processes include:
- Prevents oxidation and surface contamination during high temperature processing
- Improves interface quality and repeatability for sensitive materials
- Enables precise control of process atmosphere and gas composition
- Supports low thermal budget processes with consistent, uniform results
Wiki – Semiconductor Device Fabrication
Applications
Annealing; SiAu, SiAl, SiMo Alloying; Low k Dielectrics, Post Implanting Annealing and Thick Film Paste Firing etc.
Industry Segments
Semiconductor Wafer Fabrication, Research, Quality Assurance, Microelectronics Production, Thin and Thick Film Electronics, Electronic Assembly
Unitemp Website
Region
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark
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