Rapid Thermal Process Ovens: RTP-100/150/200
RTP 100/150/200 Key Features
- High Performance Rapid Thermal Process Ovens
- Precise ramp up and ramp down rates
- Excellent temperature uniformity
- Data logging integrated as standard
- 50 programs with 50 steps
- Small footprint
- Ergonomic front loading drawer.
Unitemp’s series of rapid thermal process (RTP) ovens comprise the RTP-100, RTP-150 and RTP-200 models, with extra power and high vacuum versions also available.
The RTP-100 is a front-loading vacuum annealing oven for substrates up to 100 mm in diameter. This single wafer system is capable of ramping up to 1500°C at rates up to 200K/s.
The RTP-150 is designed for wafers up to 150 mm diameter or 156 mm x 156 mm substrates. Ramp rates of 75K/s can be achieved in the standard model and up to 150K/s in the enhanced power version. The RTP-150 has a maximum process temperature of 1200°C
For the processing of 200 mm diameter substrates the RTP-200 is available. As with the RTP-150 this system can process up to 1200°C and ramp up at 100 K/s.
Heating of the quartz process chamber in all tools is by infrared lamps (both top and bottom heaters) and temperature control by contact thermocouple. Vacuum levels of 10e-6 hPa are achievable using the external pump system. Up to 4 process gases controlled by mass flow controller (MFC) including Oxygen, Nitrogen, Hydrogen and forming gas.
Intuitive software and process control via 7” touch panel for quick and simple programming of recipes and temperature profiles. Software allows the permanent monitoring, read-out and analysis of process gas flow, pressure, temperature and cooling water status.
System is well designed for the following applications: prototype research; quality control; annealing; SiAu, SiAl, SiMo alloying; low k dielectrics; post implanting annealing.
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Further Information
What is a Single Wafer RTP / RTA System?
A single wafer RTP or RTA system is a thermal processing tool designed to rapidly heat individual semiconductor wafers to high temperatures for very short, precisely controlled time periods. Using high‑intensity infrared lamp heating, these systems achieve fast ramp‑up and ramp‑down rates, enabling processes such as annealing, dopant activation, alloying, and post‑implantation treatments to be completed quickly while keeping the overall thermal budget low, with excellent temperature uniformity, repeatability, and process control.
Key characteristics of single wafer RTP / RTA systems include:
- Single wafer processing for precise thermal control
- Rapid heating and cooling using infrared lamp technology
- Short process times with low thermal budget
- Excellent temperature uniformity and repeatability
- Suitable for annealing, alloying, and post‑implantation processes
Wiki – Semiconductor Device Fabrication
Applications
Annealing; SiAu, SiAl, SiMo Alloying; Low k Dielectrics, Post Implanting Annealing and Thick Film Paste Firing etc.
Industry Segments
Semiconductor Wafer Fabrication, Research, Quality Assurance, Microelectronics Production, Thin and Thick Film Electronics, Electronic Assembly
Unitemp Website
Region
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark
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