Manual Die Sintering Press – P52

Key Features:

Manual die sintering press for semiconductor assembly
Process assemblies in controlled atmospheres
Designed for research, prototyping and low volume production
Suitable for Cu-Copper and Ag-Silver Sinter Pastes etc.
Manual Z-Drive with force monitoring
Process up to 110 x 110 mm assemblies
Maximum clamping force 39 kN

The P52 Manual Die Sintering Press is designed for research & development, through to prototyping and low volume production of power semiconductor, LED, RF and other assemblies using sinter pastes for die, substrate, leadframe or component attach.

The easy-to-use P52 manual die sinter press is capable of processing up to 110mm x 110mm devices with a wide range of features and capabilities, including integrated force sensing, substrate pre-heating, a maximum sintering pressure of 40 MPa and clamping force of 39 kN.

With a uniform pressure application and controlled processing atmosphere for nitrogen, forming gas or vacuum, devices can be assembled using either silver or copper sinter pastes etc.

The system is accurate and ﬂexible, with a wide range of options in order to adapt to the customer’s specific manual die sintering requirements.