Manual Sinter Press Die Attach Equipment by AMX
AMX Automatrix P50 series of manual sinter presses are designed for silver sintering or copper sintering of die, power module, RF and other related semiconductor devices in research, development, prototyping and low volume production applications.
The systems, which have been developed for use in laboratories and clean room environments, incorporate a wide range of features and capabilities also found in AMX’s more advanced semi and fully automatic models, including inert processing capabilities, uniform force application, force monitoring, large area processing, plus output of temperature and pressure profiles.
With high accuracy and reliability, the P50 series features quick change tooling and a PLC control system to rapidly change from one product type to another. Featuring three fully manual systems and two with semiautomatic hydraulic clamping, the press is available in different configurations for assemblies from 75 x 75mm up to 300 x 300mm, with forces from 16kN up to 300kN and heating up to 350oC.
AMX P50 Semiconductor Sinter Press Series
Comparison table of the different P50 Sinter Press Models.
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P51 Manual Sintering Press
The smallest footprint system capable of processing assemblies up to 75 x 75mm.
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P52 Manual Sintering Press
Identical to the P51 but with an increased processing capability up to 110 x 110mm.
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P53 Manual Sintering Press
The largest entry level system, capable of processing assemblies up to 140 x 140mm.
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P54 Semi-Manual Sintering Press
With an additional cooling circuit, the P54 can process assemblies up to 200 x 200 mm.
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P55 Semi-Manual Sintering Press
The largest processing area for assemblies up to 300 x 300 mm including wafer sintering & lamination.
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Further Information
What is a Manual Die Sintering System?
A manual die sintering system is a pressure sintering press used to attach semiconductor dies to substrates or leadframes using silver or copper sinter materials. It combines controlled temperature and applied force to create a high strength, highly conductive bonds without solder.
Loading, unloading, and cycle initiation are performed by the operator, making manual die sintering systems well suited to research, development, prototyping, and low volume production.
Key Aspects of manual die sintering systems:
- Operator controlled loading and unloading
- Suitable for silver and copper pressure sintering processes
- Flexible tooling and process control for R&D and low volume production
Inseto Knowledge Base Document:
Read our guide to the “Semiconductor Sintering Materials“
Wiki – Sintering
Applications
Die attach, Power Module Assembly, IGBT/DBC Attach, Lead-frame Attach, Wafer Level Packaging, RF Module Assembly, etc.
Industry Segments
Power Semiconductor, RF & Microwave Electronics, Universities R&D, Aerospace and Hi-Reliability Devices etc.
AMX Website
Region
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark
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