Semiautomatic Die Sintering Press – P100 Series
Key Features:
- Semiautomatic Die Sintering Press for Semiconductor assembly
- Process assemblies in controlled atmospheres
- Suitable for Cu-Copper and Ag-Silver Sinter Pastes etc.
- Automated Z-Drive with force monitoring
- Designed for prototyping through to medium production
- Optional AMX Patented “Micro-Punch” tooling
- Touch-screen interface for ease of setup and operation
- Process up to 160 x 160 mm assemblies
The P100 Series is a patented semiautomatic sintering press designed for research and development through batch production of power semiconductor, LED, RF and other assemblies using sinter paste processes for die, substrate or component attach.
The systems are equipped with AMX’s patented Micro-Punch tooling for advanced packaging applications, where each die is pressed independently, guaranteeing uniform pressure regardless of die height variation and substrate configuration. It is the ideal solution for advance package sintering of Si, SiC, Clips and sensors.
With a controlled processing atmosphere for Nitrogen or other inert gases, devices can be assembled using either silver or copper sinter pastes etc.
Available in a range of configurations, according to the specific production requirements, options include pre-heating, post cooling, plus alternative sinter tooling. The systems continuous force monitoring system ensures high quality, repeatable results on assemblies up to 160 x 160 mm.
P100 Die Sinter Press Technical Downloads
File
P100 Datasheet
Download
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Further Information
What is a Semiautomatic Die Sintering System
A semiautomatic die sintering system is a pressure sintering press used to attach semiconductor dies to substrates or leadframes using silver or copper sinter materials, combining manual loading with automated control of force application, Z axis movement, temperature, and dwell time to deliver consistent, repeatable bond quality.
These systems bridge the gap between fully manual presses and fully automatic production tools, making them well suited to advanced R&D, prototyping, and small to medium batch production where higher process stability and control are required.
Key Aspects of semiautomatic die sintering systems:
- Manual loading and unloading with automated sintering cycle execution
- Closed loop control of force, temperature, and process timing
- Suitable for silver and copper pressure sintering processes
- Higher repeatability and process stability than fully manual systems
Inseto Knowledge Base Document:
Read our guide to the “Semiconductor Sintering Materials“
Wiki – Sintering
Applications
Die attach, Power Module Assembly, IGBT/DBC Attach, Lead-frame Attach, Wafer Level Packaging, RF Module Assembly, etc.
Industry Segments
Power Semiconductor, RF & Microwave Electronics, Universities R&D, Aerospace and Hi-Reliability Devices etc.
AMX Website
Region
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark
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