Manual Die Sintering Press – P55

The P55 Die Sintering Press is designed for research & development, through to prototyping and low volume production of power semiconductor, LED, RF and other assemblies using sinter pastes for die, substrate, leadframe or component attach, plus wafer sintering and laminating.

The easy-to-use P55 manual die sinter press is capable of processing up to 300mm x 300mm devices and 300mm wafers, with a wide range of features and capabilities, including integrated force sensing, substrate pre-heating and cooling, a maximum sintering pressure of 40 MPa and clamping forces of 100 kN or 300 kN. Temperature and pressure profile curves can also be exported by FTP server or USB.

With a uniform pressure application for low to high forces and controlled processing atmosphere for nitrogen, forming gas or vacuum, devices can be assembled using either silver or copper sinter pastes etc. It is also possible to modulate the clamping stroke to pressure sinter thicker components like molded packages on pin-thin heatsinks.

Featuring a semiautomatic hydraulic clamping system, the equipment is accurate and flexible, with a wide range of options in order to adapt to the customer’s specific die or wafer sintering and laminating requirements.