Tabletop Scanning Acoustic Microscope: X-Sam M51
Key Features:
- Semiautomatic scanning acoustic microscope (SAM)
- Non-destructive SAM inspection of electronic devices
- Flexible configurations according to specified needs
- Advanced ultrasonic control for optimal results
- Scanning frequency up to 250 MHz
- Processing area: 400 x 200 mm
The X-SAM M51 scanning acoustic microscope (SAM) is designed for semiautomatic inspection of power semiconductor and other electronic assemblies, ensuring process capability and repeatability.
Acoustic microscopy employs high-frequency ultrasounds to non-destructively penetrate materials to make visible images of internal features, including defects such as cracks, delamination’s and voids. This technique is particularly useful for inspecting electronic solder joints, as it allows for the detection of hidden defects or imperfections within the solder joints themselves, such as air bubbles, gas inclusions, or foreign materials.
The M51 is a tabletop, high-precision acoustic inspection microscope featuring an intuitive user interface to easily setup and perform R&D activities, or day by day sample inspections. The system is designed for laboratory and cleanroom environments for rapid testing, analysis and quality inspection after sintering, or other bonding operations.
The X-SAM M51 delivers high-performance acoustic microscopy, utilising advanced ultrasonic control for optimal results, scanning frequency up to 250 MHz, manual loading, resolution up to 10µm per pixel and a scanning area of up to 400 x 200mm.
X-SAM M51 Technical Downloads
File
X-SAM M51 Datasheet
Download
Related Products
Automatic Inline Acoustic Inspection Equipment
MORE
Manual Die Sintering Equipment
MORE
Semiautomatic Die Sintering Equipment
MORE
Die Shear and Materials Test
MORE
Vacuum Reflow Ovens
MORE
Knowledge Base Articles
Description
Description
Sintered Die Attach for High Power Silicon Carbide Devices (IKB084)
Link
Description
Die Attach Process: Guidance and Setup (IKB-072)
Link
Description
Understanding Shear Test: Ball Bond and Die Shear (IKB-018)
Link
Description
Solder Die Attach For High Power Applications (IKB-016)
Link
Further Information
What is a Scanning Acoustic Microscope?
A Scanning Acoustic Microscope (SAM) is a high-resolution, non-destructive inspection tool that uses ultrasonic waves, typically in the range of 5 MHz to 400 MHz to visualize internal structures, and detect defects within solid materials. Unlike optical microscopes, which rely on light, SAM employs focused sound waves to penetrate a specimen and generate images based on differences in acoustic impedance between materials. This makes it ideal for examining subsurface features that are invisible to conventional imaging techniques.
How It Works:
- A piezoelectric transducer emits ultrasonic pulses into the sample, usually through a water medium.
- These waves reflect at interfaces where material properties change (e.g., voids, cracks, delaminations).
- The reflected signals are analyzed to construct detailed images, enabling precise localization of defects.
Wiki – Acoustic Microscopy
Applications
Void analysis of solder and Sintered Joints, Wafer Bump and Surface Inspection, Process Quality Control
Industry Segments
Power Electronics, Semiconductor, RF & Microwave Electronics, LED, Universities R&D, Aerospace and Hi-Reliability Devices etc
AMX Website
Region
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark
Request Form
Back to top