uCHEM Wet Bench Etching Equipment
Wet Bench Etching Deck
- Available for Cleaning, Etching, Dissolving etc.
- Spin coater, Hot plates, Rinsing & Megasonic cleaning etc.
- Manual through fully automated systems, including doising and drain
- Batch or Single Wafer Versions; customized solutions are possible
- PLC controlled with Touch Panel for easy operation
- Housing is made of polypropylene or stainless steel for solvents
- Heatable Quartz Tank for clean wafer processing
- Standard Overflow Rinse, optional: QDR, SRD
The etching unit μChem is a wet bench etching process tool suitable for all standard wet etch chemical process steps used in the semiconductor, optical, solar-cell and MEMS industries.
The ideal wet etch tool for either industrial or R&D demands due to the flexible arrangement and build-up of the processes modules. The complete system is built from plastics (PP white) or stainless steel to guarantee the maximal resistance against chemical attacks of either acids, bases or solvent processes. The plumbing can be made from PP, PVDF, PFA or SS tubing and the door materials are from a transparent PVC.
The MOT team additionally offers customised solutions tailored to the specific technical details of your wet etch chemical process. The applications lab in Germany has all necessary tools to process wafers, measure results and optimise the configuration to help select chemistries and advise you on the options available each step of the way.
Suitable for wafer sizes up to 300 mm the μChem etching system is used for a variety of applications from MEMS and CMOS production to sensor and photovoltaic device fabrication. A variety of options are available from automatic robot handling; overflow circulation with filtration; ultra or mega sonic nozzle dispense units; internal chemical management and the integration of pre/post process cells and laminar flow units. Additional components such as third party spin coater, hotplates and megasonic cleaning systems can be integrated.
Technical Downloads
File
μChem Wet Bench Etch Equipment Brochure
Download
Related Products
Manual Resist Spin Coating Machine

MORE
Manual Wafer Hot Plate

MORE
Plasma Etch-Ashing System

MORE
Semi-Automatic Resist Coat & Developers

MORE
Semiconductor Wafers

MORE
Knowledge Base Articles
Description
Description
Photolithography Basics (IKB-038)
Link
Description
Photo-resist Coating Methods (IKB-067)
Link
Description
Introduction to Photoresist Coatings (IKB-086)
Link
Further Information
What is Wet Bench Etching Equipment?
Wet bench etching equipment is a specialised wet process system used in semiconductor wafer fabrication to chemically remove material from wafer surfaces in a controlled and repeatable manner. The equipment enables precise management of process parameters such as chemical concentration, temperature and flow to ensure uniform etch results across the wafer.
In semiconductor manufacturing, wet bench etching tools are used for cleaning, surface preparation and etching steps across a wide range of materials. Typical applications include oxide and metal etching, resist removal and wafer conditioning for MEMS, CMOS and compound semiconductor processes. These systems often integrate rinsing and drying modules to support complete wet process sequences within a cleanroom compatible platform.
Inseto Knowledge Base Document:
Read our guide to the “Semiconductor Photolithography Basics“
Wiki – Semiconductor Device Fabrication
Wet Bench Etching Applications
Cleaning, Etching and Dissolving Semiconductor Wafers and Substrates for MicroFluidic Devices, Power Semiconductors, MEMS Devices, Compound & GaN Materials, Photonic, Photovoltaic and LED Components etc.
Industry Segments
Semiconductor Wafer Fabrication, University Research and Development, Microtechnology and electronics, Optical and Photonics industries.
MOT Mikro Website
Region
United Kingdom, Ireland, Finland, Sweden, Denmark, Estonia, Iceland & Norway
Request Form








Back to top