uSRD Wafer Spin Rinse Dryer
Wafer Spin Rinse Dryer Capabilities:
- Chamber Ionization
- DI-Reclaim
- DI Heating System
- Tool less exchangeable insert made of plastic
- For running different wafer sizes
- Resistivity Monitoring
- Stainless Steel Version
- Fire suppression System for solvents
The MOT μSRD is an advanced Spin Rinse Dryer system developed by M-O-T GmbH. The μSRD is designed for cleaning and drying wafers following all wet chemical batch applications. The standalone MOT μSRD is specially designed for easy operation and maintenance and the unit can be seamlessly integrated into the other MOT wet bench solutions such as μChem, μGalv, μPorsi and μChem-ECES
A single cassette of wafers is placed in an easily exchanged stainless steel rotor. To ensure resistance from a wide range of chemicals (both acids and bases) the chamber of the system is made of plastic (PP white) with a PVC door. The wafer basket can hold both high profile and low profile wafer cassettes up to 25 wafers. As with all MOT solutions, the system is compatible with wafers up to 300 mm in diameter.
The μSRD has the capability to store 10 pre configured recipes, these can be written, updated and modified by the user using the intuitive μSRD and operating software and touch panel interface. The recipes can be selected individually or clustered to create a more complex spin, rinse dry protocol.
Technical Downloads
File
μSRD Wafer Spin Rinse Dryer Equipment Brochure
Download
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Knowledge Base Articles
Description
Description
What is Spin Coating? (IKB-075)
Link
Description
Photolithography Basics (IKB-038)
Link
Further Information
What is Spin Rinse Dryer Equipment?
Spin rinse dryer (SRD) equipment is a specialised wafer cleaning and drying system used in semiconductor fabrication to remove residual chemicals and moisture following wet processing steps. The process combines deionised water rinsing with controlled high speed spinning and heated nitrogen drying to achieve particle free and spot free wafer surfaces.
In semiconductor manufacturing, spin rinse dryers are used after wet bench processes such as etching, plating and cleaning. By providing consistent and uniform drying across wafer batches, these systems help prevent contamination, watermark formation and process variability, supporting high yield manufacturing environments.
Inseto Knowledge Base Document:
Read our guide to the “Semiconductor Photolithography Basics“
Wiki – Semiconductor Device Fabrication
Spin Rinse Dryer Applications
Cleaning of cassettes of Semiconductor Wafers after Wet Bench or other process steps.
Industry Segments
Semiconductor Wafer Fabrication, University Research and Development
MOT Mikro Website
Region
United Kingdom, Ireland, Finland, Sweden, Denmark, Estonia, Iceland & Norway
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