uPorSi Porous Silicon Formation Wet Bench
Porous Silicon Formation Deck
ETCHING MODULES:
- Overflow circulation with filtration
- Customized Chamber amount selection
- PLC controlled
- Touch Panel for easy operation
RINSING MODULE:
- Standard: Overflow Rinse
- Optional: QDR, Pentane, IPA
The MOT μPorSi system is designed to enable the formation of porous silicon and add to the range of fabrication techniques supported. The complete production process is offered by MOT as well as support in ramping up to production levels at the installation site.
Porous silicon is a material formed from single crystalline silicon through anodic dissolution in HF containing solutions. Optionally available, an optical window allows for light-assisted porous silicon formation. Customised solutions are available on consultation with the MOT technical team and the flexible arrangement and configuration of the μPorSi system make it the ideal tool for R&D and production environments.
As with the μChem and μGalv systems the μPorsi is suitable for wafers up to 300 mm in diameter. The system is constructed from white polypropylene (PP) with transparent PVC door materials. The plumbing in the system can be from PP, PVDF or PFA tubing. All systems controlled by a simple, intuitive touch panel.
A variety of options are available from automatic robot handling; light assisted porous silicon formation; fully metal ion free water processing; internal chemical management and the integration of pre/post process cells and laminar flow units.
Technical Downloads
File
μPorSi Porous Silicon Formation Tool Brochure
Download
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Knowledge Base Articles
Further Information
What is Porous Silicon Formation Equipment?
Porous silicon formation equipment is a specialised wet bench system used in semiconductor fabrication to create porous structures in single crystalline silicon through controlled anodic dissolution in HF based chemical solutions. The process enables precise control of material properties such as porosity and layer depth, which are critical for functional device performance.
In semiconductor manufacturing, porous silicon formation equipment is used for applications including optoelectronic devices, LEDs, photovoltaics and sensor structures. The systems often combine porous silicon formation with electropolishing and integrated rinsing steps, enabling stable and repeatable processing within a cleanroom compatible environment.
Inseto Knowledge Base Document:
Read our guide to the “Semiconductor Photolithography Basics“
Wiki – Semiconductor Device Fabrication
Wet Bench Porous Silicon Applications
Porous Silicon Formation for LED, Photovoltaics and other Semiconductor Devices.
Industry Segments
Semiconductor Wafer Fabrication, University Research and Development, Microtechnology and electronics, Optical and Photonics industries.
MOT Mikro Website
Region
United Kingdom, Ireland, Finland, Sweden, Denmark, Estonia, Iceland & Norway
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