Sintered Dicing Blade
Sintered dicing blades from ADT are manufactured using a close‑mould sintering process where diamond grit is embedded within a metal bonding matrix that is optimised for blade hardness, load resistance and long term stability. Sintered dicing blades are widely used in applications where controlled wear and consistent package geometry are required.
What is a Sintered Dicing Blade?
Sintered dicing blades, also known as metal bond dicing blades, are precision annular diamond cutting tools designed to provide a balanced combination of wear resistance, dimensional stability, and cutting accuracy. They are manufactured in a unique close-mould sintering process where diamond grit size, diamond concentration and metal binder are optimised to meet the precision and blade life requirements for the application.
The metal binder provides a very stable, stress-free blade matrix and can be custom tailored to meet the required hardness and load resistance for dicing a variety of applications. With a slower wear rate than Resin but faster than Nickel, metal bond dicing blades are best suited for retaining package shape and size in applications such as BGA, Soft Alumina, Titanium Carbide (TiC), LTCC and Ferrite.
Key Features of Sintered Dicing Blades
- The widest variety of matrixes for a broad range of applications
- Sintered blades feature slower wear rate than Resin but faster than Nickel
- Less wear/higher blade life
- Highly accurate blade dimensions
- Blade thickness varies from 3 mil to 60 mil
- Diamond grit size ranges from 2 microns to 70 microns
Sintered Dicing Blade Resources
Dicing Process Handling Tips
ADT – Metal-Bond (Sintered) Blades Brochure
Key Characteristics of Sintered Dicing Blades
- Sintered dicing blades exhibit a slower wear rate than resin bond blades, while wearing faster than nickel bond blades. This balanced wear behaviour provides extended blade life while maintaining stable cutting performance.
- The metal bonding matrix delivers a stress‑free and highly stable blade structure, resulting in controlled wear characteristics. This make them ideal for both soft and moderately hard substrates where precision is critical.
- Metal bond dicing blades are well suited for a wide range of applications, including BGA packages, soft alumina, titanium carbide, LTCC, and ferrite materials.
- Customisable matrix and blade configurations enable the properties to be matched to the material type and process requirements.
Got a Question About Sintered Dicing Blades?
Whether you’re developing a new product or refining an existing process, Inseto’s team of experts is here to help.
From selecting the right sintered dicing blade to optimising your processes, we provide technical guidance, documentation, samples and on-site training to support your application needs.
Knowledge Base Articles
Related Products
Further Information
Wiki – Die Singulation
Applications
Dicing Semiconductor Wafers and Cutting Hard Materials, Cutting Precision Metal Parts, Dicing Thin Film Substrates, Cutting Ferrites, Scribing & Dicing Ceramic, Cutting Glass & Glass Filters, Dicing MEMS, Package Dice, PCB Separation, Universities Wafer Processing, Passive Component Manufacturing, Medical Devices, Glass Filter Cutting etc.
Industry Segments
Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Photonics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices, Glass Device Processing etc.
ADT Website
Region
Available from Inseto in the United Kingdom, Ireland & Nordic Region
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