Sintered Dicing Blade
Sintered Dicing Blade Key Features
- The widest variety of matrixes for a broad range of applications
- Sintered blades feature slower wear rate than Resin but faster than Nickel
- Less wear/higher blade life
- Highly accurate blade dimensions
- Blade thickness varies from 3 mil to 60 mil
- Diamond grit size ranges from 2 microns to 70 microns
Sintered dicing blades, also known as metal bond dicing blades, are manufactured in a unique close-mold sintering process, where diamond grit size, diamond concentration and metal binder are optimized to meet the precision and blade life requirements of your specific application.
The metal binder provides a very stable, stress-free blade matrix and can be custom tailored to meet the required hardness and load resistance for dicing a variety of applications.
With a slower wear rate than Resin but faster than Nickel, Metal Bond dicing blades are best suited for retaining package shape and size in applications such as BGA, Soft Alumina, Titanium Carbide (TiC), LTCC and Ferrite.
Please contact us with your specific application or dicing blade requirements.
Sintered Dicing Blade Technical Downloads
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Dicing Process Handling Tips
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File
ADT – Metal-Bond (Sintered) Blades Brochure
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Knowledge Base Articles
Further Information
What are Sintered Dicing Blades
Sintered dicing blades, also known as metal bond dicing blades, are precision annular diamond cutting tools designed to provide a balanced combination of wear resistance, dimensional stability, and cutting accuracy.
Manufactured using a close‑mould sintering process, diamond grit is embedded within a metal bonding matrix that is optimised for blade hardness, load resistance, and long term stability.
Sintered dicing blades are widely used in applications where controlled wear and consistent package geometry are required.
Key characteristics of sintered dicing blades include:
- Sintered dicing blades exhibit a slower wear rate than resin bond blades, while wearing faster than nickel bond blades. This balanced wear behaviour provides extended blade life while maintaining stable cutting performance.
- The metal bonding matrix delivers a stress‑free and highly stable blade structure, resulting in controlled wear characteristics. This make them ideal for both soft and moderately hard substrates where precision is critical.
- Metal bond dicing blades are well suited for a wide range of applications, including BGA packages, soft alumina, titanium carbide, LTCC, and ferrite materials.
- Customisable matrix and blade configurations enable the properties to be matched to the material type and process requirements.
Inseto Knowledge Base Document:
Read our guide to the “Dicing Blade Selection“
Wiki – Die Singulation
Applications
Dicing Semiconductor Wafers and Cutting Hard Materials, Cutting Precision Metal Parts, Dicing Thin Film Substrates, Cutting Ferrites, Scribing & Dicing Ceramic, Cutting Glass & Glass Filters, Dicing MEMS, Package Dice, PCB Separation, Universities Wafer Processing, Passive Component Manufacturing, Medical Devices, Glass Filter Cutting etc.
Industry Segments
Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Photonics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices, Glass Device Processing etc.
ADT Website
Region
Available from Inseto in the United Kingdom, Ireland & Nordic Region
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