Resin Bond Dicing Blade
Resin bond dicing blade from ADT are manufactured through a unique proprietary molding process, providing exceptional dimensional stability and repeatability. An extensive range of standard and custom manufactured resin bond dicing blades are available, from 2″ to 5″ diameter and from 0.003 to 0.1″ in thickness, with serrated edges for specific applications. Diamond grit sizes vary from 3 to 200 microns.
What is a Resin Bond Dicing Blade?
Resin dicing blades are precision diamond cutting tools designed for the high quality dicing of hard and brittle materials. The blades feature a resin based bonding matrix which provides controlled wear characteristics that when cutting allows the edge of the blade to wear at a controlled rate exposing fresh diamond grit to constantly sharpen the blade. This delivers consistent performance and excellent cut quality along with highly accurate kerf, outstanding yield and exceptional blade life.
As Resin bond dicing blades wear off faster, they create less heat & friction and are therefore best suited for such materials as alumina, glass and quartz. The hub-free blades are widely used in semiconductor and advanced materials processing applications where accuracy, surface finish, and yield are critical.
Key Features of Resin Bond Dicing Blades
- Resin bond dicing blade’s provide superior cut quality
- Ideal for cutting hard/brittle materials: Ceramic, Quartz, Glass QFN HTCC etc.
- Resin blade thickness varies from 3 to 100 mil (depending on diamond grit size)
- Diamond grit size ranges from 3 to 250 microns (depending on blade thickness)
Resin Bond Dicing Blade Resources
Dicing Process Handling Tips
ADT – Resin Bond Dicing Blades Brochure
Key Characteristics of Resin Dicing Blades include:
- Resin dicing blades provide excellent edge quality and kerf accuracy, making them ideal for dicing materials such as ceramics, glass, quartz, and HTCC substrates.
- The resin bonding matrix continuously exposes new diamond particles. This self sharpening behaviour ensures stable cutting performance, outstanding yield, and extended usable blade life.
- Compared to harder bonded blades, resin dicing blades generate less heat and friction during cutting. This makes them particularly suitable for delicate or brittle materials, reducing the risk of micro cracking and material damage.
- Resin bond dicing blades are available in a broad range of diameters, thicknesses, edge types, and diamond grit sizes.
Got a Question About Resin Bond Dicing Blades?
Whether you’re developing a new product or refining an existing process, Inseto’s team of experts is here to help.
From selecting the right resin bond dicing blade to optimising your processes, we provide technical guidance, documentation, samples and on-site training to support your application needs.
Knowledge Base Articles
Related Products
Further Information
Wiki – Die Singulation
Applications
Dicing Semiconductor Wafers and Cutting Hard Materials, Cutting Precision Metal Parts, Dicing Thin Film Substrates, Cutting Ferrites, Scribing & Dicing Ceramic, Cutting Glass & Glass Filters, Dicing MEMS, Package Dice, PCB Separation, Universities Wafer Processing, Passive Component Manufacturing, Medical Devices, Glass Filter Cutting etc.
Industry Segments
Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Photonics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices, Glass Device Processing etc.
ADT Website
Region
Available from Inseto in the United Kingdom, Ireland & Nordic Region
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