Nickel Bond Dicing Blade
Annular nickel bond dicing blades from ADT are produced using a state-of-the-art electro-forming process allowing blade production to very tight tolerances and permitting optimisation of grit size, hardness and geometry to meet particular application requirements. Blade thickness varies from 0.8 mil to 20 mil (depending on diamond grit size) and diamond grit size ranges from 2-4 microns to 70 microns (depending on blade thickness).
What is a Nickel Bond Dicing Blade?
Nickel hub-free dicing blades are precision diamond cutting tools designed for applications requiring extended blade life, high rigidity, and ultra‑thin cutting performance. Manufactured using a tightly controlled electro-forming process, diamond particles are uniformly embedded within a nickel bonding layer, resulting in excellent dimensional accuracy and consistent cutting behaviour.
The Nickel binder provides longer blade life and lower wear rate and together with the abrasive makes Nickel-bond Blades a perfect choice for soft material applications such as: PCB, Silicon and BGA’s.
Key Features of Nickel Bond Dicing Blades
- The Nickel binder provides superior blade life and lower wear rate
- Ideal for soft material applications such as: PCB, Silicon and BGA
- The thinnest blade available, down to .0008”
- Excellent rigidity for higher exposure
- Blade thickness up to 0.020″ mil
- Diamond grit size ranges from 2-4 microns to 70 microns
Nickel Bond Dicing Blade Resources
Dicing Process Handling Tips
ADT – Nickel Bond Dicing Blades Brochure
Key Characteristics of Nickel Dicing Blades
- The hard nickel bonding matrix provides excellent wear resistance, resulting in significantly longer blade life and reduced blade consumption.
- The electroforming process enables the manufacture of extremely thin hub free blades. This allows for fine kerf widths, higher blade exposure, and precise control in demanding dicing applications.
- As annular blades supplied without a hub, hub free nickel dicing blades are mounted using external flanges. This provides greater flexibility in blade diameter, thickness, and exposure selection, allowing optimisation of the blade setup to suit specific materials and process requirements.
Got a Question About Nickel Bond Dicing Blades?
Whether you’re developing a new product or refining an existing process, Inseto’s team of experts is here to help.
From selecting the right nickel bond dicing blade to optimising your processes, we provide technical guidance, documentation, samples and on-site training to support your application needs.
Knowledge Base Articles
Related Products
Further Information
Wiki – Die Singulation
Applications
Dicing Semiconductor Wafers and Cutting Hard Materials, Cutting Precision Metal Parts, Dicing Thin Film Substrates, Cutting Ferrites, Scribing & Dicing Ceramic, Cutting Glass & Glass Filters, Dicing MEMS, Package Dice, PCB Separation, Universities Wafer Processing, Passive Component Manufacturing, Medical Devices, Glass Filter Cutting etc.
Industry Segments
Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Photonics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices, Glass Device Processing etc.
ADT Website
Region
Available from Inseto in the United Kingdom, Ireland & Nordic Region
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