Jet Dispensing System – Acelon

The Kulicke and Soffa ACELON is an advanced jet dispensing system designed for high-speed, high-accuracy semiconductor and electronics assembly applications. It combines non-contact jetting, closed-loop process control, and intelligent software to deliver consistent material deposition in demanding production environments, across multiple applications.

The system supports a wide range of industrial and electronics manufacturing processes, including underfill, dam and fill, solder paste dispensing, die attach adhesives, SMT assembly, and LED encapsulation. Its configurable architecture allows it to be adapted to both high volume automated production and high mix manufacturing environments.

Advanced Jet Dispensing Technology

The Acelon combines high frequency jet dispensing technology with accurate multi axis motion control to deliver consistent, repeatable dispensing without physical contact between the nozzle and substrate. This enables precise material jetting on fine pitch devices, uneven surfaces, and sensitive components while supporting higher production speeds compared to traditional contact dispensing methods.

Real time dispensing height measurement and compensation are used to maintain consistent jetting performance across substrates with varying flatness. Whilst high repeatability and positional accuracy support reduced keep out zones and improved yield, particularly in advanced packaging and miniaturised device assemblies.

Vision, Inspection, and Software Control

The Acelon incorporates integrated vision capabilities to support alignment, process monitoring, and post dispensing inspection. These tools help verify deposit material placement and coverage, reducing defect rates and improving overall process confidence.

Intelligent software functions support closed loop flow and volume control, automatic calibration routines, and process optimisation. These capabilities are intended to maintain stable jet dispensing performance over long production runs and across material changes.

Materials and Applications

The system supports a broad range of materials commonly used in electronics and semiconductor production, including epoxies, silicones, solder pastes, fluxes, and UV curable adhesives.

Typical applications include underfill dispensing, edge bonding, dam and fill processes, die attach adhesives, LED packaging, and advanced SMT assembly.