Precision Micro Dispensing System – XSL

The Kulicke and Soffa XSL Series is a high precision micro dispensing system developed for advanced packaging applications, where positional accuracy, repeatability and process control are critical. The equipment is designed to support next generation electronics manufacturing processes, including mini and micro LED packaging, fine pitch solder dispensing and high accuracy adhesive deposition.

The XSL Series combines a compact mechanical platform with advanced motion control, vision alignment and dispensing software, enabling highly repeatable dispensing at micron level accuracy across a wide range of materials and processes.

Key Capabilities

The XSL Series is engineered for applications requiring extreme precision and consistency, particularly in high density and fine feature manufacturing environments. Key performance characteristics include:

• Repeatability down to ±3 µm
• Position accuracy of ±6 µm
• Jet dispensing accuracy of ±10 µm
• High Z axis payload capacity supporting multiple process tools and sensors

The rigid machine structure and compact footprint allow the system to maintain accuracy at high dispensing speeds while accommodating a wide range of dispensing heads, cameras, laser height sensors and curing devices.

Advanced Vision and Software Control

The XSL Series is driven by Kulicke and Soffa’s V2K dispensing software platform, developed specifically for high speed precision dispensing and motion synchronisation. Key software features include integrated vision teaching and alignment, on the fly alignment and height detection, synchronous motion and jetting control to maintain dot and line uniformity, 3D dispensing capability and automatic refill and dispensing volume adjustment based on gap dimensions.

This software architecture enables complex dispensing patterns to be executed accurately at speed, supporting both contact and non contact dispensing processes.

Typical Applications

The XSL Series is suited to a wide range of advanced packaging and electronics manufacturing applications, including mini and micro LED packaging, high accuracy optical adhesive dispensing, seam filling for large panel assemblies, fine pitch solder paste jetting and high speed micro dot and line dispensing on glass and ceramic substrates.

The platform is particularly effective where uniform material height and tight process tolerances are required across complex patterns or large substrates.