XB8 Wafer Bonder
XB8 Key Features
- Bond-Force up to 100kN and Temperature up to 550°C
- Excellent Bond-Force and Temperature Uniformity
- Expansive Tooling Options covering a wide range of applications
- Multi-Bond Fixtures for stacks and multiple wafer sizes
- High Degree of Automation minimizing Operator Intervention
- Temperature Uniformity < 1.5%
- Fast heating and active cooling for high throughput
- Chamber pressure from 5 x 10-5mbar to 3bar absolute
- Open and Closed Fixtures & Centre Pin options for Fusion Bonding
The XB8 from SUSS has been developed to support a wide range of bonding processes wafers up to 200 mm in diameter. Flexible, adaptable with a comprehensive range of adjustable process parameters, the XB8 wafer bonder is an ideal Research & Development tool.
Applications include advanced packaging, 3D integration, LED and of course MEMS. All standard bonding processes are supported such as Metal Diffusion Bonding, Hybrid & Fusion Bonding, Eutectic & SLID, Adhesive Bonding, Anodic Bonding, Glass Frit processing and Temporary Wafer Bonding.
During loading, the chamber is flooded with nitrogen to ensure the best possible level of cleanliness; whilst the high level of automation minimizes the influence the operator has on the process result. Thermal decoupling of the heater from the bonding chamber enables a highly accurate, repeatable process temperature in combination with the highly repeatable, precise bonding force technology from SUSS. Independence from operator and the sophisticated design of the XB8 wafer bonder guarantee consistent process stability and optimal process results time after time.
XB8 Technical Downloads
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Knowledge Base Articles
Description
Description
What is a Wafer Bonder? (IKB-080)
Link
Description
Wafer Bonding Methods (IKB-078)
Link
Description
Semiconductor Wafer Selection Guide (IKB-046)
Link
Description
Semiconductor Wafer Description Nomenclature (IKB-044)
Link
Further Information
What is a High‑Force Wafer Bonder?
A high‑force wafer bonder is a wafer bonding system designed to apply precisely controlled, high mechanical force in combination with temperature and chamber pressure to permanently join wafer stacks.
These systems are used for demanding bonding processes such as anodic, fusion, eutectic, metal diffusion, and SLID bonding, where force uniformity, process stability, and repeatability across the wafer are critical, particularly in MEMS, advanced packaging, and three‑dimensional integration applications.
Key Aspects of a Wafer Bonder:
- Precisely controlled high bonding force across the full wafer
- Accurate control of temperature, pressure, and bonding atmosphere
- Supports multiple permanent bonding technologies
- Designed for high uniformity, repeatability, and process stability
Inseto Knowledge Base Document:
Read our guide to the “What is a Wafer Bonder?“
Wiki – Semiconductor Device Fabrication
Applications
MEMS device fabrication, Wafer‑level packaging, 3D integrated circuits, Advanced semiconductor packaging, Photonic and optoelectronic devices, Silicon‑on‑insulator and engineered substrates, Heterogeneous material integration, Microfluidic and biochip devices, Power electronics and high‑performance devices.
SUSS Website
Region
United Kingdom, Ireland, Sweden, Finland, Norway & Iceland
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