SB6/8 Gen2 Wafer Bonder
SB6/8 Gen2 Key Features
- SB6 Gen2: Irregular pieces up to 150mm wafers
- SB8 Gen2: Irregular pieces up to 200mm wafers
- Bond-Force up to 20kN and Temperature up to 550°C
- Precision Temperature Control and unrivalled Uniformity < 1.5%
- Fast Heating / Active Cooling = Reduced Process Cycle
- Ergonomic, Contamination Free Wafer Loading
- Semiautomatic operation for high Repeatability & Reproducibility
- Chamber pressure from 5 x 10-5mbar to 3bar absolute
- Various tooling options to cover a wide range of applications
- Open and Closed Fixtures & Centre Pin options for Fusion Bonding
- Multi-Bond Fixtures for stacks and multiple wafer sizes
The SB6/8 Gen2 from SUSS is the state of the art universal wafer bonder for substrates, irregular pieces and wafers up to 200mm in diameter. Supported bonding processes include: Adhesive Bonding, Anodic, Eutectic or Fusion Bonding, Glass Frit processes and Temporary Wafer Bonding.
The semiautomatic system takes over from the operator once the wafer bond fixture is placed on the machine to automatically load the fixture into the bond chamber, protecting the operator from hot surfaces and pinch points while simultaneously avoiding contamination and variation in processing through human error.
The highly accurate temperature and force control technology within the SB6/8 Gen 2 provide unrivalled uniformity to the bonding process, making the SB6/8 Gen 2 the ideal system for Research & Development. Applications include MEMS device fabrication, advanced packaging, 3D integration and photonic systems manufacture.
The SB6/8 Gen2 is suitable for both packaging as well as structuring; meeting the requirements for advanced packaging, LED, MEMS, and 3D integration.
SB6/8 Gen2 Technical Downloads
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Knowledge Base Articles
Description
Description
What is a Wafer Bonder? (IKB-080)
Link
Description
Wafer Bonding Methods (IKB-078)
Link
Description
Semiconductor Wafer Selection Guide (IKB-046)
Link
Description
Semiconductor Wafer Description Nomenclature (IKB-044)
Link
Further Information
What is a Permanent Wafer Bonder?
A wafer bonder is a specialised tool used to permanently join two wafers together in semiconductor and MEMS manufacturing. This process creates multi-layer structures essential for advanced devices.
Key aspects of a permanent Wafer Bonder:
- Bonds wafers using heat, pressure, and sometimes vacuum or gas environments.
- Supports various bonding methods: adhesive, anodic, fusion, and thermo-compression.
- Enables integration of different materials for complex device architectures.
- Critical for applications like MEMS, wafer-level packaging, sensors, and optical components.
- Ensures high precision and uniformity for reliable performance.
Inseto Knowledge Base Document:
Read our guide to the “What is a Wafer Bonder?“
Wiki – Semiconductor Device Fabrication
Applications
MEMS device fabrication, Wafer‑level packaging, 3D integrated circuits, Advanced semiconductor packaging, Photonic and optoelectronic devices, Silicon‑on‑insulator and engineered substrates, Heterogeneous material integration, Microfluidic and biochip devices, Power electronics and high‑performance devices.
SUSS Website
Region
United Kingdom, Ireland, Sweden, Finland, Norway & Iceland
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