XBS200 Wafer Bonder
XBS200 Key Features
- Fully Automated Wafer Bonder for up to 200mm wafers
- Bonding force up to 100kN
- Maximum Process Temperature 550°C
- Cluster concept, configured according to requirements
- Integrated Metrology Capability
- Unique Laser Pre-Bond
XBS200 Wafer Bonder
The XBS200 platform from SUSS allows for fully automatic aligned wafer bonding of materials up to 200 mm in diameter. Its versatile, modular design offers maximum process flexibility in all permanent bonding tasks.
The novel SUSS “aligned-wafer transfer” method eliminates the complexity of traditional systems and offers consistent, stable process results with excellent system availability. The XBS200 platform offers low cost of ownership for high-volume production of MEMS, LED and 3D devices. Supported bonding processes include: Metal Diffusion Bonding, Hybrid & Fusion Bonding, Eutectic & SLID, Adhesive Bonding, Anodic Bonding, Glass Frit processing and Temporary Wafer Bonding.
SYSTEM FEATURES:
- Supports wafers up to 200mm
- Bonding force: 60 or 100 kN, repeatability: < 2 %
- Temperature ≤ 550 °C, repeatability: < 1.5%
- Chamber pressure: 5×10-5 mbar – 3 bar
- Precise process recipe control for all bond parameters
- Ramp function
- Fast heating (30 K/min) and active cooling (30 K/min)
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Knowledge Base Articles
Description
Description
What is a Wafer Bonder? (IKB-080)
Link
Description
Wafer Bonding Methods (IKB-078)
Link
Description
Semiconductor Wafer Selection Guide (IKB-046)
Link
Description
Semiconductor Wafer Description Nomenclature (IKB-044)
Link
Further Information
What is an Automatic Wafer Bonder?
An automatic wafer bonder is a fully automated wafer bonding system used to permanently join aligned wafer pairs with high precision and repeatability.
By integrating automated wafer handling, alignment, bonding, and process control, these systems deliver consistent results at high throughput and support a wide range of permanent bonding processes, including anodic, fusion, eutectic, metal diffusion, SLID, and adhesive bonding, making them well suited to MEMS, LED, advanced packaging, and three dimensional integration applications.
Key Aspects of a Wafer Bonder:
- Fully automated wafer handling, alignment, and bonding
- High precision and repeatability for volume production
- Supports multiple permanent wafer bonding technologies
- Designed for high throughput, yield, and process stability
Inseto Knowledge Base Document:
Read our guide to the “What is a Wafer Bonder?“
Wiki – Semiconductor Device Fabrication
Applications
MEMS device fabrication, Wafer‑level packaging, 3D integrated circuits, Advanced semiconductor packaging, Photonic and optoelectronic devices, Silicon‑on‑insulator and engineered substrates, Heterogeneous material integration, Microfluidic and biochip devices, Power electronics and high‑performance devices.
SUSS Website
Region
United Kingdom, Ireland, Sweden, Finland, Norway & Iceland
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