ECD8 Compact Resist Coater or Developer
ECD8 Key Features
- Compact footprint for substrates up to 200 mm
- Configurable as either a resist coater or a resist developer
- Up to two dispense lines and pump configurations
- Suitable for materials from <1 cps to 4000 cps
- Spin speed up to 8,000 rpm, acceleration up to 10,000 rpm/sec
- One hand wafer centering, universal for round wafers
- Integrated media cabinet for a tidy all in one setup
- Intuitive symbol based interface for easy operation & training
- Recipe control with storage for up to 200 custom recipes
- Highest safety features, designed to protect operators and substrates
The SUSS ECD8 is a compact semi automatic coating or developing platform designed for research, development and small scale production environments processing substrates up to 200 mm. The system combines flexible configuration with a small footprint, making it well suited to cleanrooms where space efficiency, ease of use and reliable process control are essential.
Available as either a resist coater or a resist developer, the ECD8 can be configured to match specific lithography process requirements while maintaining a consistent operating concept across applications. Its integrated media cabinet removes the need for external cabinets, simplifying installation and preserving valuable cleanroom space.
Operation of the ECD8 is optimised for daily laboratory use. A one hand wafer centring mechanism allows fast and accurate alignment across all round wafer sizes, while the fully transparent enclosure provides complete process visibility throughout coating or developing steps. An intuitive, symbol based touchscreen interface supports straightforward recipe creation and real time monitoring of process parameters, reducing training effort and improving repeatability between users.
The ECD8 delivers precise control for a wide range of coating and developing processes. High spin speeds and acceleration enable uniform film formation, while support for multiple dispense configurations allows processing of materials with viscosities from below 1 cps up to 4,000 cps. Recipe based control with storage for up to 200 process recipes ensures consistent results across development cycles and production runs.
Designed with operator safety and reliability in mind, the ECD8 incorporates high safety standards as standard and draws on SUSS MicroTec’s experience in production proven coating and developing platforms. The result is a robust, flexible system that bridges the gap between manual laboratory tools and larger automated coating and developing equipment.
SUSS also manufacture the LabSpin range of high-performance manual resist spin coat and puddle develop tools and RCD8 range of semi-automatic coating tools.
Technical Downloads
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SUSS Product Overview Brochure
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Knowledge Base Articles
Description
Description
What is Spin Coating? (IKB-075)
Link
Description
Photo-resist Coating Methods (IKB-067)
Link
Description
Introduction to Photoresist Coatings (IKB-086)
Link
Description
Photolithography Basics (IKB-038)
Link
Description
Imprint Photolithography (IKB-054)
Link
Description
Photolithography Exposure Modes (IKB-053)
Link
Further Information
What is a Spin Coater?
A spin coater is a wafer processing system used to apply thin, uniform layers of liquid materials, most commonly photoresists, onto substrates. The coating is formed by dispensing material onto the substrate surface and rotating it at high speed, allowing centrifugal force to spread the material evenly.
Spin coaters are widely used in lithography processes for semiconductor, MEMS and microelectronic fabrication, where controlled film thickness and repeatability are critical. Modern spin coating systems combine programmable spin profiles and controlled dispensing to support reliable process development and small scale production.
Key aspects of a spin coater include:
- Application of liquid materials onto a substrate followed by high‑speed rotation
- Forms a uniform film coating through centrifugal force
- Thickness & uniformity controlled by spin speed, acceleration, time & viscosity
- Excess material is expelled from the substrate edge during spinning
- Widely used in lithography and microelectronic fabrication
Inseto Knowledge Base Document:
Read our guide to the “Introduction to Photoresist Coatings“
Wiki – Semiconductor Device Fabrication
Applications
UV Lithography, Wafer Resist Coating with Spin, Spray or Puddle Dispense, Resist Developing, Wafer Cleaning, Metal Layer Lift Off, Baking, Wafer Prime etc.
Industry Segments
Semiconductor research and development and small series production.
SUSS Website
Region
United Kingdom, Ireland, Sweden, Finland, Norway & Iceland
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