AS8 Semiautomatic Wafer Spray Coater
AS8 Key Features
- Compact Semiautomatic Wafer Spray Coater
- Precision Wafer Coating Equipment
- Uniform coating even of highly structured surfaces
- Substrate sizes up to 200mm in diameter
- Square substrates up to 6″ edge length
- SUSS MicroTec spray design for optimal process stability
- Up to 2 independent spray dispense systems
- Recipe controlled process parameters
SUSS produces the AS8 Semiautomatic Wafer Spray Coater designed for up coating up to 200mm wafers.
The manually loaded AS8 wafer spray coating tool is the ideal platform for R&D and low-volume device fabrication and can be equipped with two independent spray resist coating dispense systems, avoiding cross contamination; the SUSS proprietary spray design, coupled with the sophisticated resist supply system, provides unmatched process stability, repeatability and reproducibility.
The spray-coat technology within the AS8 is ideal for use when substrates have a topography with tall existing features; a wide range of textures and high levels of surface roughness. The system is able to achieve uniform coatings of photo-resists required for high resolution photo-lithography.
All spray and cleaning parameters are programmed and controlled in the on board recipe; this allows for system program transfer to SUSS’s range of automated tools when the customer see the need for higher throughput.
For advanced applications requiring automated wafer handling, SUSS also manufacture a the ACS200 range of high-performance fully automatic coat-develop tools, which can be configured with multiple spray coating stations.
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Knowledge Base Articles
Description
Description
What is Spin Coating? (IKB-075)
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Photo-resist Coating Methods (IKB-067)
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Introduction to Photoresist Coatings (IKB-086)
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Photolithography Basics (IKB-038)
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Imprint Photolithography (IKB-054)
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Photolithography Exposure Modes (IKB-053)
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Further Information
What is a Semiconductor Spray Coater?
A semiconductor spray coater is a wafer processing tool used to apply photoresists and other functional coatings uniformly across substrates with complex or high‑aspect‑ratio topographies. Unlike traditional spin coating, spray coating atomises the resist and deposits it evenly onto the wafer surface, making it particularly effective for substrates with deep features, sharp edges or significant surface roughness.
Key aspects of fully automated wafer coating and developing include:
- Conformal Coverage, uniform coating over tall features and complex geometries
- Process Stability, through controlled spray parameters & proprietary nozzle design
- Material Efficiency, reducing resist pooling and edge bead formation
- Application Flexibility, a wide range of substrate types and lithographic processes
Inseto Knowledge Base Document:
Read our guide to the “Introduction to Photoresist Coatings“
Wiki – Semiconductor Device Fabrication
Applications
Wafer Resist Coating of substrates with high topographies
Industry Segments
Wafer level chip-scale packaging, flip chip packaging, bumping, MEMS, LED, power devices, optical components and compound substrates and other semiconductor related device production applications
SUSS Website
Region
United Kingdom, Ireland, Sweden, Finland, Norway & Iceland
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