iBond5000 Wedge Bonder
iBond5000W Key Features
- Ultrasonic Wedge-Wedge bonder for wire & ribbon bonding
- Bonds Aluminium, Gold, Copper and Silver wire processes
- Programmable looping profiles including lange-coupler mode
- 30/45 and 90 (deep access) degree wire feed configurations
- Consistent tail length control with fine adjust
- Simple to use semiautomatic and manual operation modes
- Comprehensive range of work holders and customised fixtures
- User friendly touch screen graphical user interface
- Large bondable area: 135 mm x 135 mm (5.3” x 5.3”)
The iBond 5000 manual wedge bonder is the latest model from MPP (formerly K&S Manual Wire Bonders Division), for ultrasonic Wedge- Wedge Multiple Stitch & Ribbon bonding using aluminium, gold or copper wires.
The bench-top system features advanced electronics, Windows CE control software and a modern user touch-screen interface. The equipment’s is ergonomically designed and based on the proven 4500 series, ensuring high build quality and consistent results and allows the system to be configured for right hand or left hand operation to suit the operators preference.
The system enables saving and loading of custom files, along with factory pre-configured profiles, for storing, cataloguing, and re-using golden processes. The bonding profiles internal library, which includes a bonding wires database, further enhances the ease of use and caters for various applications. The iBond5000W has an abundance of advanced options for improved efficiency and expertise, while also lowering cost of ownership.
The model is ideal for process development, production, research and supplemental manufacturing support. It provides excellent yield and repeatability needed for high-end applications including: Optoelectronic Modules, Hybrids/MCMs, Microwave Products, Discrete Devices/Lasers, Chip-on-board, MEMS , Sensors ,Bio Medical and High Power Devices etc.
iBond5000 Wedge Bonder Technical Downloads
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iBond5000 Wedge Brochure
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Knowledge Base Articles
Description
Description
What is Wire Bonding? (IKB-015)
Link
Description
MPP & KnS Deep Access Clamp Adjustments (IKB-007)
Link
Description
MPP & KnS 30/45 Degree Clamp Adjustments (IKB-021)
Link
Description
Fine Wire Wedge Bond Sequence (IKB-002)
Link
Description
Understanding Wire Pull Testing (IKB-003)
Link
Description
MPP Bonding Wedge Tool Nomenclature (IKB-010)
Link
Description
MPP Fine Wire Wedge Tool: Feed Hole to Wire Diameter Recommendations (IKB-065)
Link
Description
MPP Ribbon Wedge Tool: Slot Size to Ribbon Size Recommendations (IKB-066)
Link
Description
View more Wire Bonding related “Knowledge Base Documents”
Link
Further Information
What is Wedge Bonding?
Wedge bonding is a proven wire bonding technology used to create reliable electrical interconnections in microelectronics and advanced packaging applications.
The process uses wedge bonding tools to apply controlled force and ultrasonic energy to form a solid state bond between the wire or ribbon, and the bond pad. This method is particularly well suited to aluminium or gold wire and ribbon bonding, fine pitch layouts, and applications requiring excellent control of bond placement and loop geometry.
Key characteristics of wedge bonding include:
- Fine pitch capability: Allows bonds to be placed very close together
- Low profile interconnections: Can produce flat, low loop bonds
- Material and process flexibility: Supports aluminium and gold wire and ribbon
- High reliability and repeatability: Creates strong metallurgical bonds
Inseto Knowledge Base Document:
Read our free guide to “What is a Wire Bonding?“
Wiki – Wire Bonding Overview:
Applications
Microelectronic Assemblies, Chip-on-Board Assemblies, Microwave Devices, Semiconductor Devices, Process and Product development, Microelectronic Devices, Bio Medical devices, Nano-electronics, MEMS devices, Interconnect technology , Chip-on-Board assemblies, Multi-Chip-Modules, RFID, Batteries
Industry Segments
Automotive, Aerospace, Military, Telecommunications, Bio – Medical Electronics, Photonics, Solar Cell, Nano – electronics, Fibre Optics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Packaging, PCB and Subcontract assembly, Universities, Research and Development
MPP Manual Wire Bonder Website
Region
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark
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