iBond5000 Ball Bonder
iBond5000B Key Features
- Ball bonding, bumping, coining and single point TAB applications
- Bonds Gold, Copper and Silver wire process options
- Simple to use with semiautomatic and manual operation modes
- User friendly touch screen graphical user interface
- Smart EFO unit with stop on missing ball function
- Comprehensive range of work holders and customised fixtures
- Large bondable area: 135 mm x 135 mm (5.3” x 5.3”)
The iBond5000 manual ball bonder is the latest model from MPP (formerly K&S Manual Wire Bonders Division), for bonding and bumping of gold or copper wires. The iBond5000Ball is an advanced manual wire bonder for gold ball bonding (copper and silver optional) used throughout research & development laboratories, Universities, engineering and production facilities.
The bench-top system features advanced electronics, Windows CE control software and a modern user touch-screen interface. The equipment’s is ergonomically designed and based on the proven 4500 series, ensuring high build quality and consistent results and allows the system to be configured for right hand or left hand operation to suit the operators preference.
The system enables saving and loading of custom files, along with factory preconfigured profiles, for storing, cataloguing, and re-using golden processes. The bonding profiles internal library, which includes a bonding wires database, further enhances the ease of use and caters for various applications. The iBond5000 has an abundance of advanced options for improved efficiency and expertise, while also lowering cost of ownership.
The model is ideal for process development, production, research and supplemental manufacturing support. It provides excellent yield and repeatability needed for high-end applications including: Optoelectronic Modules, Hybrids/MCMs, Microwave Products, Discrete Devices/Lasers, Chip-on-board, MEMS , Sensors ,Bio Medical and High Power Devices etc.
iBond5000 Ball Bonder Technical Downloads
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iBond5000 Ball Brochure
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Knowledge Base Articles
Description
Description
What is Wire Bonding? (IKB-015)
Link
Description
MPP & KnS Manual Workholder Setup (IKB-006)
Link
Description
MPP & KnS NEFO Setup (IKB-022)
Link
Description
Ball Bond Sequence (IKB-001)
Link
Description
Kulicke & Soffa Capillary Nomenclature (IKB-011)
Link
Description
Bonding Wire Sizes and Selection (IKB-037)
Link
Description
Bond Wire Handling Considerations (IKB-023)
Link
Description
View more Wire Bonding related “Knowledge Base Documents”
Link
Further Information
What is Ball Bonding?
Ball bonding is a wire bonding process used in microelectronic assembly to form electrical connections between a semiconductor die and its package or substrate. The connections are most commonly made using either fine gold, silver or copper wires.
The process uses thermosonic energy, combining heat, ultrasonic energy, and controlled force to bond the wires to the die pad and then to the package lead. The first bond is formed using a spherical ball, which allows the wire to be drawn from the top of the ball in any direction, without requiring tool rotation or alignment.
This omnidirectional capability is a key advantage of ball bonding when compared with wedge bonding, where the tool orientation defines the bonding direction and limits routing flexibility. The ball bond process is widely used due to its speed, consistency, and suitability for high density interconnects.
Key characteristics of ball bonding include:
- Ball bonding produces highly uniform and consistent metallurgical wire bonds
- Wide material compatibility and multiple wire types, including Au, Cu and Ag
- Enables precision fine pitch interconnects for dense device layouts
- Flexible process with omnidirectional bonding capability
Inseto Knowledge Base Document:
Read our free guide to “What is a Wire Bonding?“
Wiki – Wire Bonding Overview:
Applications
Microelectronic Assemblies, Chip-on-Board Assemblies, Microwave Devices, Semiconductor Devices, Process and Product development, Microelectronic Devices, Bio Medical devices, Nano-electronics, MEMS devices, Interconnect technology , Chip-on-Board assemblies, Multi-Chip-Modules, RFID, Batteries
Industry Segments
Automotive, Aerospace, Military, Telecommunications, Bio – Medical Electronics, Photonics, Solar Cell, Nano – electronics, Fibre Optics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Packaging, PCB and Subcontract assembly, Universities, Research and Development
MPP Manual Wire Bonder Website
Region
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark
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