iBond5000 Dual – Convertible Ball and Wedge Wire Bonder
iBond5000D Key Features
- Ball bonding, bumping, coining, security bond, and Tab bond
- Ultrasonic Wedge-Wedge, Stitch & Ribbon bonding
- Bond with either Al/Si, Al, Au, Cu or Ag wire
- Deep access wire feed for wedge and ball bonding
- Quick and easy changeover between applications by operator
- Consistent tail length control with fine adjust
- Simple to use semiautomatic and manual operation modes
- Smart EFO unit with stop on missing ball function
- User friendly touch screen graphical user interface
- Comprehensive range of work holders and customised fixtures
- Large bondable area: 135 mm x 135 mm (5.3” x 5.3”)
The iBond5000Dual enables fine aluminium and gold wire wedge or ribbon bonding utilising a deep access wire feed system. For gold or copper ball bonding, the system features a Patented N-EFO to generate the ball bond, which is mounted on a unique swing arm assembly, providing simplified changeover between bonding modes, including:
- Ball, Bump & Wedge bonding gold wires: 17-70 microns dia.
- Wedge Bonding Aluminium Wires: 20-75 microns dia.
- Ball bonding copper wires: 17-50 microns dia.
- Ribbon Bonding: 25 x 250 micron gold ribbon.
An internal bonding profiles library, which includes a bonding wires database, further enhances the ease of use and caters for various applications.
Additional features include Ethernet connection for centralised management, the capability to save and load custom files, along with factory pre-configured profiles, for storing, cataloging, and re-using golden processes. A bonding profiles internal library, which includes a bonding wires database, further enhances the ease of use. The iBond5000 also has an abundance of advanced options for improved efficiency and expertise, while also lowering cost of ownership.
The model is ideal for process development, production, research and supplemental manufacturing support. It provides excellent yield and repeatability needed for high-end applications including: Optoelectronic Modules, Hybrids/MCMs, Microwave Products, Discrete Devices/Lasers, Chip-on-board, MEMS, Sensors, Bio-Medical and High Power Devices etc.
iBond5000 Dual – Convertible Ball and Wedge Bonder Technical Downloads
File
iBond5000 Dual Brochure
Download
Related Products
Bonding Wire & Ribbon
More
Bonding Wedges and Collets
More
Automatic Wire Bonders
More
Bond and Materials Test Equipment
More
Technical Support Services
More
Knowledge Base Articles
Description
Description
What is Wire Bonding? (IKB-015)
Link
Description
Ball Bond Sequence (IKB-001)
Link
Description
Fine Wire Wedge Bond Sequence (IKB-002)
Link
Description
Understanding Wire Pull Testing (IKB-003)
Link
Description
MPP Bonding Wedge Tool Nomenclature (IKB-010)
Link
Description
Kulicke & Soffa Capillary Nomenclature (IKB-011)
Link
Description
MPP Fine Wire Wedge Tool: Feed Hole to Wire Diameter Recommendations (IKB-065)
Link
Description
MPP Ribbon Wedge Tool: Slot Size to Ribbon Size Recommendations (IKB-066)
Link
Description
Bonding Wire Sizes and Selection (IKB-037)
Link
Description
View more Wire Bonding related “Knowledge Base Documents”
Link
Further Information
What is a Convertible Ball and Wedge Bonder
A convertible manual ball and wedge bonder is a wire bonding system designed to perform both ball bonding and wedge bonding using a single machine.
Conversion between bonding methods is achieved through simple tool changes rather than separate dedicated platforms, allowing different interconnect techniques to be used on the same workstation.
Operation is manual or semi manual, with the operator controlling bonding position and sequence, while process parameters are managed through the system controls.
Key characteristics of a convertible ball & wedge bonder:
- Capable of both ball bonding and wedge bonding using a single manual platform.
- Bond placement and sequencing are controlled by the operator.
- Supports ultrasonic and thermosonic bonding of fine wires and ribbons.
- Used in research, process development and low to medium volume manufacturing.
Inseto Knowledge Base Document:
Read our free guide to “What is a Wire Bonding?“
Wiki – Wire Bonding Overview:
Wire Bonding Applications:
Microelectronic Devices, Chip-on-Board Assemblies, Microwave Devices, Multi-Chip-Modules, Semiconductor Components, Development, Microelectronic Devices, Bio Medical Assembly, Nanoelectronics, MEMS Device Interconnect, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development
Industry Segments
Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Photonics, Solar Cell, Nano Electronics, Fibre Optics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities
MPP Manual Wire Bonder Website
Region
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark
Request Form
Back to top