Ryan Maughan, Managing Director at Transense and the new precision Die Bonding Equipment
Inseto has supported Transense Technologies plc in the scale up of its SAWsense sensor manufacturing capability through the supply and installation of a bespoke high precision die bonding platform.
The system has been implemented to support the transition of SAWsense from advanced process development into scalable, repeatable manufacturing. SAWsense technology is based on patented Surface Acoustic Wave sensing and is used to measure torque, force and temperature in demanding environments including aerospace, automotive, robotics, electric drivetrains and motorsport.
Commenting on the project, Ryan Maughan, Managing Director at Transense Technologies plc, said:
“Inseto’s support was a key part of delivering this project successfully. From equipment selection through to installation and commissioning, the team worked closely with us to ensure the platform met the precision, flexibility and scalability we required. Their application knowledge and hands on support gave us confidence that the system will underpin our manufacturing roadmap as SAWsense moves into high volume production.”
Inseto has extensive experience supporting advanced packaging and sensor manufacturing across the UK, Ireland and Nordics, working with customers to deliver equipment, process expertise and local support for demanding production and research environments.
At MicroTech 2026, PacTech presented the latest developments in laser based assembly technologies, highlighting how these processes are enabling advanced semiconductor packaging and heterogeneous integration across both fine pitch and large scale applications.
The presentation focused on laser solder ball placement and jetting, a flux free, contactless process capable of placing and reflowing solder balls from 40 µm to 2500 µm. Using highly localised, selective laser heating with millisecond scale reflow, the process significantly reduces thermal stress on sensitive devices, limits intermetallic growth, and delivers excellent process control for fine pitch interconnects. Typical applications include via filling, solder stacking, selective rework, and complex 2D and 3D packaging architectures.
PacTech Wafer and Device Solder Bumping with Simultaneous Laser Reflow
PacTech also introduced its LAPLACE laser assisted bonding and reflow technology. This approach uses modulated laser beams combined with optical temperature monitoring to achieve fast, controlled reflow exclusively at the bonding interface. By avoiding bulk heating, LAPLACE supports high placement accuracy, reduces package warpage, and enables reliable bonding of dissimilar materials with high CTE mismatch, an increasingly critical requirement for heterogeneous integration.
Together, these laser based assembly technologies address demanding requirements across photonics, power semiconductor devices, sensors, and multi die systems. The presentation demonstrated how precision laser processes can deliver the flexibility, accuracy, and long term reliability required for next generation semiconductor packaging.
Inseto works closely with PacTech to support customers across the UK and Ireland with advanced assembly solutions. To find out how laser soldering, bonding, and reflow technologies can support your advanced packaging or heterogeneous integration challenges, please contact the Inseto team.
Inseto is pleased to announce its support of Engineering Intelligently, a TechWorks event delivered as part of the Women in TechWorks programme, hosted at ARM, Cambridge, on 17th June 2026.
The event will bring together engineers, industry leaders, and allies from across the semiconductor and advanced electronics sector to explore how the engineering profession is evolving, and how organisations can better support long term, sustainable engineering careers.
Our industry depends on highly skilled people, fresh thinking, and clear pathways for engineers to develop and progress over time. Creating the right environment for this does not happen by chance. It requires open discussion, shared experience, and a willingness to challenge established ways of working. Events such as Engineering Intelligently play an important role in enabling these conversations and encouraging practical action.
Join Inseto at the first in-person Women in TechWorks event at Arm, Cambridge, on 17th June 2026
Engineering Intelligently focuses on the realities of modern engineering careers, with discussion centred around mentoring, leadership, retention, and the changing nature of engineering roles. The programme also considers the growing influence of emerging technologies, including artificial intelligence, and how these tools are shaping day to day engineering practice, decision making, and skills requirements across the sector.
As a long standing supplier to the semiconductor and advanced electronics community, Inseto recognises the importance of supporting initiatives that strengthen the talent pipeline and improve inclusivity within engineering. Sponsoring this event reflects our commitment to supporting professional development, knowledge sharing, and collaboration across the industry.
The Women in TechWorks programme provides a valuable platform for highlighting diverse perspectives, supporting career development, and promoting best practice across the technology ecosystem. Engineering Intelligently offers an opportunity for participants to engage openly with peers, learn from shared experiences, and gain practical insight into how organisations can better support engineers at all stages of their careers.
As members of TechWorks NMI, Inseto is proud to support the Women in TechWorks initiative, and we look forward to the discussions and insights that will emerge from this event.
Inseto is pleased to announce its sponsorship of MicroTech 2026, the annual IMAPS UK conference dedicated to advancing semiconductor packaging technologies.
MicroTech 2026 is the UK’s leading event focused on semiconductor packaging, bringing together industry, academia and research organisations to explore developments in advanced and heterogeneous packaging, reliability and manufacturing strategies. The conference provides an important forum for technical exchange, collaboration and knowledge sharing across the microelectronics community.
The event will take place on Thursday 26 March 2026 at the King’s Conference Centre, Hedge End, Southampton. Inseto looks forward to meeting customers, partners and colleagues from across the sector and supporting discussions that help drive innovation in semiconductor packaging and advanced manufacturing.
IMAPS-UK Annual Conference MicroTech – Driving Innovation in Semiconductor Packaging
Enabling Next Generation Photonics at G&H Torquay with High Precision Die Bonding
Inseto has successfully installed a Tresky T‑5300‑W Semi‑Automatic Die Bonder at Gooch and Housego’s Torquay facility, strengthening the company’s advanced photonic packaging capabilities.
The T‑5300‑W was selected to replace legacy manual equipment that could no longer meet increasing requirements for placement accuracy, process control, and throughput. The system provides sub‑micron placement accuracy and high repeatability, supporting a wide range of die attach processes including eutectic bonding, flip‑chip, epoxy dispense and stamping, UV curing, and die sorting.
Configured with wafer handling capability, precision alignment optics, heating options, and a second spindle for pre‑form handling, the Tresky platform offers the flexibility needed for both R&D and production environments. Tresky’s True Vertical Technology ensures consistent parallelism between die and substrate, delivering reliable bond quality across increasingly complex photonic assemblies.
The installation is now fully operational in Gooch and Housego’s production cleanroom and has already delivered improvements in accuracy, repeatability, and cycle time, supporting the company’s long‑term manufacturing strategy in high‑performance photonics.
Gary Smith, new technical support engineer at Inseto, pictured following his manual wire bonder equipment training
Inseto is pleased to announce that Gary Smith has joined our team as a Technical Support Engineer.
In this role, Gary will enhance our service capability across the UK and Europe, supporting equipment installations, repair, maintenance and calibrations. His appointment strengthens our ongoing commitment to providing reliable, responsive and technically proficient support to our customers.
Gary’s experience and approach align strongly with our focus on delivering high standards of service and ensuring customers receive the highest level of technical assistance throughout the lifecycle of their equipment.
We are delighted to welcome Gary to Inseto and wish him every success in his new role.
Tresky T5300 Semi-Automatic Die Bonder installed at SINTEF Digital
Inseto has released a new case study highlighting how the Tresky T‑5300 Semiautomatic Die Bonder is supporting advanced research into MEMS sensor devices and next‑generation microelectronic assemblies.
The featured organisation is conducting early‑stage development work that requires high‑precision die placement, repeatable bond‑line control, and the flexibility to handle a wide range of die geometries and materials. The T‑5300’s architecture, built around True Vertical Technology™, a motorised programmable Z‑axis, and a highly adaptable tooling platform, proved well‑suited to these requirements.
Key outcomes highlighted in the case study include:
Improved placement accuracy for prototype MEMS structures
Reduced process variability during adhesive and low‑temperature bonding
Faster iteration cycles thanks to flexible tooling and rapid setup changes
Reliable handling of irregular die shapes and heterogeneous integration tasks
The case study demonstrates how the T‑5300 enables researchers to validate assembly parameters at the R&D stage before transitioning to automated production equipment.
Charities supported by Inseto include: Hampshire & Isle of White Air Ambulance, Andover Foodbank, The Three Bees Project, The Countess of Brecknock Hospice and The Abel Foundation.
At Inseto, we believe the festive season is about more than celebration, it’s about community, compassion, and making a positive difference.
This Christmas, we’re proud to support several charities, each nominated by our employees, including Hampshire & Isle of White Air Ambulance, Andover Foodbank, The Three Bees Project, The Countess of Brecknock Hospice and The Abel Foundation.
Through our donations, we aim to help those in need, whether that’s providing food, or vital support services during what can be a difficult time of year for many.
We’re grateful to our team, partners, and customers who make it possible for us to give back. Together, we can ensure the spirit of Christmas shines a little brighter for everyone.
From all of us at Inseto, we wish you a joyful holiday season and a Happy New Year!
Over four days, our technical team engaged with industry leaders, showcased SemiProbe’s advanced wafer probing platforms, and explored collaborative opportunities to drive semiconductor innovation.
Highlights from the Week
Booth Visitors: Our stand attracted engineers and decision-makers eager to discuss wafer-level testing solutions.
Technology Showcase: SemiProbe systems demonstrated modularity and precision for R&D and production test environments.
Networking: Valuable conversations with partners and prospects reinforced Inseto’s role as a key technology provider.
Industry Connections: Productive meetings with existing partners and new prospects.
Semicon 2025, a busy end to day two – more insights and connections
Thank You
We extend our sincere thanks to everyone who visited our stand and contributed to making SEMICON Europa 2025 a great success.
Get Expert Advice on Wafer Probing Equipment
For those unable to attend, our team is ready to provide detailed information and demonstrations on our wafer probing equipment tailored to your requirements.
Adam Wood (left) and Chris Valentine of Inseto at the UK National Quantum Technologies Showcase event, London, November 2025.
Inseto is delighted to announce the appointment of Adam Wood to our technical sales team. Adam will be responsible for wafer sales, a key area of our business that continues to grow in importance as we strengthen support for our customers.
With extensive experience in semiconductor equipment and materials sales, Adam brings a wealth of technical knowledge and commercial insight. His expertise will enable us to deliver exceptional service and create real value for our business partners, helping them achieve their goals in an increasingly competitive market.
Adam’s appointment reflects our ongoing commitment to providing world-class support and solutions across the semiconductor sector. We are confident that his contribution will further enhance our wafer sales offering and reinforce our position as a trusted partner.
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