Gold Bonding Wire
Gold Bonding Wire Key Features
- 99.99% gold bonding wire (other variants available)
- High-purity vacuum-processed from highly refined metals
- Diameters from 12.5µm (0.0005″) up to 125µm (0.005″)
- Uniform elongation and tensile strength across the complete spool
- For manual and automatic wire bonding equipment
- Manufacturing process controls ensure enhanced looping
Coining specialises in manufacturing high-purity (up to 99.99%) gold wire for ball bonding and wedge bonding processes. In-house casting, drawing, rolling, annealing, plus complete analytic capabilities, ensure a finished product that is completely homogeneous, with ultra-clean surfaces and a smooth finish.
Coining manufactures gold wire in a full range of diameters – 12.5µm (0.0005″) to 125µm (0.005″) – that meet customer requirements for strength and hardness / elongation in all applications.
The gold wire is high-purity vacuum-processed from highly refined metals and provided on a wide range of wire spool types, suitable for use on all models of wire bonding equipment. Applications include interconnect of semiconductor devices, wafer bumping, stud bump and interconnect of other microelectronic and related assemblies.
By using strictly controlled doping processes, Coining has a long-standing reputation for providing custom wire properties for specialised applications using automatic wire bonders. Wire is also supplied for use on manual equipment.
For information on bonding wire properties that should be considered when selecting a wire type, please look at our Knowledge Based Fact Sheet here.
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Knowledge Base Articles
Description
Description
Bonding Wire Sizes & Selection (IKB-037)
Link
Description
Bond Wire Handling Considerations (IKB-023)
Link
Description
Kulicke & Soffa Capillary Nomenclature (IKB-011)
Link
Description
MPP Bonding Wedge Tool Nomenclature (IKB-010)
Link
Description
Ball Bond Sequence (IKB-001)
Link
Description
Fine Wire Wedge Bond Sequence (IKB-002)
Link
Description
Understanding Wire Pull Testing (IKB-003)
Link
Further Information
What Is Gold Bonding Wire?
Gold bonding wire is an ultra‑fine, high‑purity gold wire used to create electrical interconnections within semiconductor and microelectronic devices. It forms the critical link between a semiconductor die and its package, substrate, or lead frame, carrying electrical signals and power while maintaining mechanical integrity throughout the life of the device.
Gold bonding wire is widely used in ball bonding and wedge bonding processes due to its stable bonding behaviour and long‑term reliability in demanding applications.
Key characteristics of Gold Bonding Wire:
- Gold offers excellent electrical conductivity, enabling low‑resistance signal transmission and stable device performance.
- Gold is highly ductile, allowing the wire to deform plastically during bonding without cracking or fracturing.
- Unlike many alternative metals, gold does not oxidise or corrode under normal operating conditions.
- Gold bonding wire provides a wide process window, enabling consistent bonding across a range of temperatures, forces, and ultrasonic settings.
Inseto Knowledge Base Document:
Read our free guide to “What is Wire Bonding?“
Wiki – Wire Bonding Overview:
Applications
Wire Bonding, Ribbon Bonding, Material Interconnect, Heat Dissipation, Thermal Interface, Package Construction & Sealing, etc.
Industry Segments
Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Photonics Components, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices
Region
Available from Inseto in the United Kingdom, Ireland & Nordic Region
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