Si/Al Bonding Wire
Si/Al Bonding Wire Key Features
- Fine aluminium bonding wire alloyed with 1% silicon
- Excellent electrical conductivity, ensures low-resistance interconnections
- Diameters from 18µm (0.0007″) to 75µm (0.003″)
- Microscopic checks of the alloy structure of the finished lots
- Optimised for wedge bonding with superior bondability
- Idea for automated and manual processing with snag-free de-reeling
Inseto supplies high-quality fine aluminium bonding wire manufactured by AMATEK-Coining, a global leader in precision metal products. Our Al-Si bonding wire is engineered for reliability in semiconductor packaging, hybrid circuits, and advanced microelectronic assemblies.
In order to ensure that uniform high quality bonds can be obtained at high production speeds, special controls are used in the manufacture of 1% silicon-aluminium wire.
At Coining, special attention is given to the most important characteristic of high grade bonding: homogeneity. Microscopic checks of the alloy structure of the finished lots of 1% silicon-aluminium wire are routinely performed.
Wire processing is carried out under conditions that yield the ultimate in surface cleanliness and smooth finish and permits entirely snag-free de-reeling.
Si/Al Bonding Wire Technical Downloads
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Coining SiAl Bonding Wire Data Sheet
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Coining Company Brochure
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Further Information
What Is Si/Al Bonding Wire?
Si/Al bonding wire, also known as aluminium‑silicon (Al‑Si) bonding wire, is a fine aluminium alloy wire typically containing around 1% silicon. It is used as an electrical interconnect in semiconductor and microelectronic assembly, most commonly in ultrasonic wedge bonding processes. Si/Al bonding wire is widely adopted where aluminium metallisation is present on the device, as it provides excellent metallurgical compatibility, stable bond formation, and long‑term reliability in demanding environments.
The addition of silicon to high‑purity aluminium improves mechanical stability and bonding performance compared with pure aluminium wire.
Key characteristics of Si/Al Bonding Wire:
- Excellent compatibility with Aluminium metallisation, minimises intermetallic formation issues.
- The controlled addition of silicon enhances the wire’s mechanical stability, improving tensile strength and elongation consistency. This allows the wire to deform predictably during bonding, supporting stable bond foot formation and looping.
- Si/Al bonding wire can be bonded ultrasonically at room temperature, reducing the need for additional heat. This makes it well suited to temperature‑sensitive devices.
- Aluminium‑silicon bonding wire provides good electrical conductivity for signal transmission and effective thermal conductivity for heat dissipation.
Inseto Knowledge Base Document:
Read our free guide to “What is Wire Bonding?“
Wiki – Wire Bonding Overview:
Applications
Wire Bonding, Ribbon Bonding, Material Interconnect, Heat Dissipation, Thermal Interface, Package Construction & Sealing, etc.
Industry Segments
Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Photonics Components, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices
Coining Website
Region
Available from Inseto in the United Kingdom, Ireland & Nordic Region
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