Gold Bonding Ribbon
Coining produces gold ribbon for RF/microwave and high bit rate applications. These ribbons are typically custom-manufactured to exacting specifications, producing unparalleled uniformity of width and thereby minimising snagging in the bonding wedge, resulting in significant reductions of machine downtime.
What is Gold Bonding Ribbon?
Gold bonding ribbon is a flat, ultra‑fine strip of high‑purity gold used as an electrical interconnect in semiconductor and microelectronic assemblies. It performs the same fundamental role as bonding wire, creating electrical and mechanical connections between a semiconductor die and a substrate, lead frame, or another die, but its rectangular cross‑section provides distinct electrical, thermal, and mechanical advantages in certain applications.
Gold bonding ribbon is most commonly used in wedge bonding processes, particularly in RF and high‑frequency applications, where the skin effect concentrates current at the surface and in high‑power devices, and where performance and reliability are critical.
Key Features of Gold Bonding Ribbon
- High-purity gold for high frequency and high bit rate applications
- Custom-manufactured to exacting specifications
- Very tight dimensional tolerances of ±3%
- Less machine downtime due to tolerances
Advantage of Gold Ribbon over Gold Round Wire
The advantage of ribbon over round wire is the relatively large surface area in proportion to the cross-section area. The more extreme this relationship, the less effect that frequency has on the effective resistance of the material, resulting in greater efficiency of ribbon-bonded products. Since a majority of the free electrons are near the surface anyway, the resistance caused by the skin effect does not have such a drastic impact on the ribbon as it does on round wire.
In addition, signal crosstalk is significantly reduced in ribbon-bonded applications, leading to better signal quality in high frequency devices and less electrical noise on the supply or ground contacts. This is because, while at lower frequencies the parasitic capacity of the wire-antenna may be neglected, in the GHz range wires really start to exchange signals, leading to increased interference.
Key Characteristics of Gold Bonding Ribbon
- The flat geometry of gold bonding ribbon provides a larger contact surface than round wire, reducing electrical resistance and inductance.
- Gold bonding ribbon can carry a higher current than an equivalent diameter round wire due to its increased cross‑sectional area.
- Excellent Thermal Performance with the ribbons wider flatter profile enhancing heat dissipation.
- Manufactured from high‑purity gold, bonding ribbon offers excellent resistance to corrosion and oxidation.
Got a Question About Gold Bonding Ribbon?
Whether you’re developing a new product or refining an existing process, Inseto’s team of experts is here to help.
From selecting the right bonding ribbon to optimising your processes, we provide technical guidance, documentation, samples and on-site training to support your application needs.
Knowledge Base Articles
Description
Bond Wire Handling Considerations (IKB-023)
MPP Bonding Wedge Tool Nomenclature (IKB-010)
MPP Fine Wire Wedge Tool: Feed Hole to Wire Diameter Recommendations (IKB-065)
MPP Ribbon Wedge Tool: Slot Size to Ribbon Size Recommendations (IKB-066)
Fine Wire Wedge Bond Sequence (IKB-002)
What is Wire Bonding (IKB-015)
Related Products
Further Information
Wiki – Wire Bonding Overview
Applications
Wire Bonding, Ribbon Bonding, Material Interconnect, Heat Dissipation, Thermal Interface, Package Construction & Sealing, etc.
Industry Segments
RF/HF Devices, Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Photonics Components, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices
Region
Available from Inseto in the United Kingdom, Ireland & Nordic Region
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