Fine Wire Wedge Bond Sequence

The fine wire wedge bond sequence for both manual and automatic equipment can be explained in eight steps:

• STEP 1: RESET / REST / IDLE: Wire is located under the bonding tool between surfaces (chip or lead).
• STEP 2: FIRST SEARCH: Tool descends to first bond search height for final positional (X, Y) adjustment.
• STEP 3: FIRST BOND: Tool brought into contact with surface – force is pre-set value – ultrasonic energy applied for pre-set time to form first bond weld.
• STEP 4: LOOP HEIGHT: Tool is raised to pay wire out from spool (clamps open) to pre-set loop height value.
• STEP 5: LOOP FORMATION: Tool steps back to second bond position (manual or automatic).
• STEP 6: SECOND SEARCH: Tool descends to second bond search height for final positional (X, Y) adjustment.
• STEP 7: SECOND BOND + TERMINATION: Tool brought into contact with surface – second bond made as stage 2.
• STEP 8: TAIL FEED: Following 2nd bond, clamps close and break off wire at bond heel (or via table tear). Wire is then fed back under the tool (tail) for next bond.