Dielectrics, Glazes & Sealing Glasses
Dielectrics, Glazes & Sealing Glasses Key Features
- Range of lead-free and cadmium-free pastes
- Choice of materials for alumina or aluminium nitride (AlN) ceramics
- Wide range of firing temperatures (350ºC – 900ºC)
Koartan’s dielectrics fulfil two purposes – they can be used as general purpose insulation materials, and also as high-K materials suitable for the integration of capacitors in thick film microcircuits, which may be buried within layers of multilayer systems.
These materials are compatible with gold-based, silver-based and mixed-metal-based conductor systems. They form a crystallising composition, allowing resistor firing and component attachment on top. They are CTE matched to alumina, and provide an excellent surface for fine-line printing of gold conductors and subsequent gold wire bonding.
Koartan’s glaze materials can be used as over-glazes or sealing materials. They are CTE-matched to various substrates including alumina and silicon. Other uses include low temperature firing applications, sealing lids to silicon substrates, and as a low temperature cover coat to protect circuitry on silicon wafers. Lead-free and cadmium-free options are also available, as well as specific options for resistor, capacitor, and ferrite core inductor protection.
Dielectrics, Glazes & Sealing Glasses Technical Downloads
File
Koartan Thick Print Gold Paper – IMAPS2002
Download
File
Koartan Laser Trim Methods For NTC Thermistors
Download
Thick Film Dielectrics Product Range
Part#
Type
Description
Part#
537X
Type
Dielectric
Description
Pb-free versions of 535X series, K25 to K500 capacitor dielectric, blendable, fire at 850ºC
Download
Part#
5483
Type
Dielectric
Description
High-K capacitor dielectric for ICs, networks & shielding, fires at 850ºC
Download
Part#
5804
Type
Dielectric
Description
Filled glass dielectric for multilayer gold & crossover applications, fires at 850 – 875ºC
Download
Part#
5807
Type
Dielectric
Description
Crystallising dielectric for silver & mixed-metal mulitilayer circuitry, fires at 850ºC
Download
Part#
5816
Type
Dielectric
Description
Crossover dielectric for AlN, fires at 850ºC
Download
Part#
5866
Type
Dielectric
Description
Low temperature, crystallising dielectric, fires at 600ºC
Download
Thick Film Glazes Product Range
Part#
Type
Description
Part#
5600 / 1
Type
Glaze
Description
Green (5600) or black (5601), acid-resistant overglaze protecting from plating & water fluxes, fires at 600ºC
Download
Part#
5635
Type
Glaze
Description
White, ultra-low temperature overglaze or sealing paste, fires at 350°C
Download
Part#
5643W
Type
Sealing
Description
White, sealing glass designed for sealing MEMS devices, fires at 425 – 450°C
Download
Part#
5645
Type
Glaze
Description
Green, composite glass providing strong film, fires at 450°C
Download
Part#
5645-SI
Type
Sealing glaze
Description
Gray, silicon-matched CTE for lid sealing, also low temperature coating, fires at 450°C
Download
Part#
5650
Type
Glaze
Description
Green overglaze for resistors & general protection purposes, fires at 500°C
Download
Part#
5651
Type
Glaze
Description
Green, Pb & Cd free, < 3% resistor shift, fires at 500 – 530°C
Download
Part#
5652
Type
AlN Glaze
Description
Green, low temperature overglaze for AlN, fires at 525 – 530°C
Download
Part#
5660
Type
AlN Glaze
Description
Green, low temperature, acid-resistant overglaze for AlN, fires at 600°C
Download
Part#
5662
Type
AlN Glaze
Description
Green, low temperature, Palladium-saver overglaze for AlN, fires at 600 – 650°C
Download
Part#
5671
Type
Glaze
Description
Green, low temperature capacitor overglaze, CTE-match to alumina, fires at 520 – 540°C
Download
Part#
5672
Type
Glaze
Description
Green, high temperature capacitor overglaze, CTE-match to alumina, fires at 850°C
Download
Part#
5680G
Type
Glaze
Description
Green, Pb & Cd free, fully vitreous, fires at 750 – 900°C
Download
Part#
5685
Type
Glaze
Description
Blue glaze, Pb & Cd free, designed to bond small substrates together, fires at 850 – 900ºC
Download
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Knowledge Base Articles
Description
Description
Laser Trimming Basics (IKB-052)
Link
Description
Adhesives for Die Attach (IKB-071)
Link
Description
Die Attach Process: Guidance and Setup (IKB-072)
Link
Description
Bonding Wire Sizes & Selection (IKB-037)
Link
Description
Bond Wire Handling Considerations (IKB-023)
Link
Further Information
What are Dielectrics, Glazes and Sealing Glasses
Dielectrics, glazes and sealing glasses are thick film materials used to provide electrical insulation, environmental protection, and mechanical sealing within thick film and hybrid microelectronic circuits.
Screen printed onto ceramic or compatible substrates and fired at controlled temperatures, these materials form insulating layers, protective overcoats, or hermetic and near‑hermetic seals that support multilayer circuit construction and device reliability.
Key characteristics of thick film dielectrics, glazes and sealing glasses include:
- Dielectrics are used to electrically insulate conductors and form crossover or multilayer structures within thick film circuits.
- Glazes act as protective overcoats, shielding circuitry from moisture, contamination, and mechanical damage.
- Sealing glasses are used to bond and seal components providing environmental protection and mechanical integrity.
- These materials are screen printed and fired to form stable glass or ceramic layers bonded to the substrate.
Inseto Knowledge Base Document:
Read our guide to “Laser Trimming Basics“
Wiki – Thick Film Technology
Applications
Microelectronic Devices, Microwave Devices, Heating Elements, Printable Resistors & Thermistors
Industry Segments
Microelectronic / Hybrid Assembly, Photonic Devices, Microwave Electronics, Automotive Electronics, Wireless Telecommunications, Data Processing, Instrumentation, Military, Consumer Electronics, Industrial Electronics
Koartan Website
Region
Available throughout Europe from Inseto
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