Inseto

Dielectrics, Glazes & Sealing Glasses

Koartan’s dielectrics fulfil two purposes – they can be used as general purpose insulation materials, and also as high-K materials suitable for the integration of capacitors in thick film microcircuits, which may be buried within layers of multilayer systems.

Thick Film Printed Gold Pastes

What are Dielectrics, Glazes and Sealing Glasses?

Dielectrics, glazes and sealing glasses are thick film materials used to provide electrical insulation, environmental protection, and mechanical sealing within thick film and hybrid microelectronic circuits.

Screen printed onto ceramic or compatible substrates and fired at controlled temperatures, these materials form insulating layers, protective overcoats, or hermetic and near‑hermetic seals that support multilayer circuit construction and device reliability.

Key Features of Dielectrics, Glazes and Sealing Glasses

  • Range of lead-free and cadmium-free pastes
  • Choice of materials for alumina or aluminium nitride (AlN) ceramics
  • Wide range of firing temperatures (350ºC – 900ºC)
Koartan Thick Film Printed Gold Pastes

About Koartan Dielectrics, Glazes and Sealing Glasses

These materials are compatible with gold-based, silver-based and mixed-metal-based conductor systems. They form a crystallising composition, allowing resistor firing and component attachment on top. They are CTE matched to alumina, and provide an excellent surface for fine-line printing of gold conductors and subsequent gold wire bonding.

Koartan’s glaze materials can be used as over-glazes or sealing materials. They are CTE-matched to various substrates including alumina and silicon. Other uses include low temperature firing applications, sealing lids to silicon substrates, and as a low temperature cover coat to protect circuitry on silicon wafers. Lead-free and cadmium-free options are also available, as well as specific options for resistor, capacitor, and ferrite core inductor protection.

Key Characteristics of Dielectrics, Glazes and Sealing Glasses

  • Dielectrics are used to electrically insulate conductors and form crossover or multilayer structures within thick film circuits.
  • Glazes act as protective overcoats, shielding circuitry from moisture, contamination, and mechanical damage.
  • Sealing glasses are used to bond and seal components providing environmental protection and mechanical integrity.
  • These materials are screen printed and fired to form stable glass or ceramic layers bonded to the substrate.
Microelectronic Thick Film AIN Pastes

Got a Question About Dielectrics, Glazes and Sealing Glasses?

Whether you’re developing a new product or refining an existing process, Inseto’s team of experts is here to help.

From selecting the right dielectric, glaze or sealing glass to optimising your processes, we provide technical guidance, documentation, samples and on-site training to support your application needs.

Thick Film Dielectrics Product Range

Part# 537X

Type

Dielectric

Description

Pb-free versions of 535X series, K25 to K500 capacitor dielectric, blendable, fire at 850ºC

Part# 5483

Type

Dielectric

Description

High-K capacitor dielectric for ICs, networks & shielding, fires at 850ºC

Part# 5804

Type

Dielectric

Description

Filled glass dielectric for multilayer gold & crossover applications, fires at 850 – 875ºC

Part# 5807

Type

Dielectric

Description

Crystallising dielectric for silver & mixed-metal mulitilayer circuitry, fires at 850ºC

Part# 5816

Type

Dielectric

Description

Crossover dielectric for AlN, fires at 850ºC

Part# 5866

Type

Dielectric

Description

Low temperature, crystallising dielectric, fires at 600ºC

Thick Film Glazes Product Range

Part# 5600 / 1

Type

Glaze

Description

Green (5600) or black (5601), acid-resistant overglaze protecting from plating & water fluxes, fires at 600ºC

Part# 5635

Type

Glaze

Description

White, ultra-low temperature overglaze or sealing paste, fires at 350°C

Part# 5643W

Type

Sealing

Description

White, sealing glass designed for sealing MEMS devices, fires at 425 – 450°C

Part# 5645

Type

Glaze

Description

Green, composite glass providing strong film, fires at 450°C

Part# 5645-Sl

Type

Sealing Glaze

Description

Gray, silicon-matched CTE for lid sealing, also low temperature coating, fires at 450°C

Part# 5650

Type

Glaze

Description

Green overglaze for resistors & general protection purposes, fires at 500°C

Part# 5651

Type

Glaze

Description

Green, Pb & Cd free, < 3% resistor shift, fires at 500 – 530°C

Part# 5652

Type

AIN Glaze

Description

Green, low temperature overglaze for AlN, fires at 525 – 530°C

Part# 5660

Type

AIN Glaze

Description

Green, low temperature, acid-resistant overglaze for AlN, fires at 600°C

Part# 5662

Type

AIN Glaze

Description

Green, low temperature, Palladium-saver overglaze for AlN, fires at 600 – 650°C

Part# 5671

Type

Glaze

Description

Green, low temperature capacitor overglaze, CTE-match to alumina, fires at 520 – 540°C

Part# 5672

Type

Glaze

Description

Green, high temperature capacitor overglaze, CTE-match to alumina, fires at 850°C

Part# 5680G

Type

Glaze

Description

Green, Pb & Cd free, fully vitreous, fires at 750 – 900°C

Part# 5685

Type

Glaze

Description

Blue glaze, Pb & Cd free, designed to bond small substrates together, fires at 850 – 900ºC

Knowledge Base Articles

Related Products

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.com

Wiki – Thick Film Technology

Thick Film Technology – Wikipedia

Applications

Microelectronic Devices, Microwave Devices, Heating Elements, Printable Resistors & Thermistors

Industry Segments

Microelectronic / Hybrid Assembly, Photonic Devices, Microwave Electronics, Automotive Electronics, Wireless Telecommunications, Data Processing, Instrumentation, Military, Consumer Electronics, Industrial Electronics

Region

Available throughout Europe from Inseto

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