Microelectronic Thick Film AIN Pastes
Microelectronic Thick Film AIN Pastes Key Features
- Complete suite of materials for Aluminium Nitride (AlN) substrates
- Tight TCR controls for high power applications
- CTE-matched for excellent adhesion over a wide temperature range
- Range of resistivities available
Koartan’s range of thick film pastes for use on AlN are blendable across the whole series and are completely lead-free. With resistivities from 100 mΩ/Sq to 3 Ω/Sq, these materials offer tight TCR controls and excellent power handling capabilities.
For heaters and other applications where a tight TCR is not required, Koartan offers the 798X series of pastes. With similar resistivities to the 796X series, the 798X series has a TCR of 300ppm ± 100ppm, suitable for more cost-sensitive products.
Koartan also offers conductive pastes specifically engineered for applications requiring high adhesion to AlN. These materials also come in a range of different resistivities – the 6292 Silver-Palladium paste has a resistivity of 18 – 22 mΩ/Sq, while the 6122 Silver paste has a resistivity of 3 – 4 mΩ/Sq.
Finally, to protect the fired circuitry of the sensitive AlN-compatible pastes, Koartan has developed a special over-glaze material, 5662. This paste fires at 600 – 650ºC and prevents the oxidisation of Palladium that normally occurs when firing higher temperature glazes, thereby significantly reducing the resistivity shift from as much as 20% or more, to ± 1%.
Microelectronic Thick Film AIN Pastes Technical Downloads
File
Koartan Laser Trim Methods For NTC Thermistors
Download
Microelectronic Thick Film AIN Pastes Product Range
Part#
Type
Description
Part#
4906
Type
Low temp
Description
Gold Conductor for AlN, fires at 600ºC
Download
Part#
5652
Type
Low temp
Description
Overglaze for AlN, fires at 525 – 530ºC
Download
Part#
5660
Type
Acid-resistant
Description
Overglaze for AlN, fires at 600ºC
Download
Part#
5662
Type
Pd-saver
Description
Overglaze for AlN, fires at 600 – 650ºC
Download
Part#
6122
Type
High adhesion
Description
Silver Conductor for AlN, fires at 850ºC
Download
Part#
6292
Type
High adhesion
Description
Silver-Palladium Conductor for AlN, fires at 850ºC
Download
Part#
6296
Type
Nano particles
Description
SILLPALL FLASH – Solder-promoting paste for AlN, fires at 580 – 620ºC
Download
Part#
7961
Type
Tight TCR
Description
Series of AgPd Power Resistors for AlN, blendable, fires at 850ºC
Download
Part#
7981
Type
Low cost
Description
Series of AgPd Power Resistors for AlN, fires at 850ºC
Download
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Knowledge Base Articles
Description
Description
Laser Trimming Basics (IKB-052)
Link
Description
Adhesives for Die Attach (IKB-071)
Link
Description
Die Attach Process: Guidance and Setup (IKB-072)
Link
Description
Bonding Wire Sizes & Selection (IKB-037)
Link
Description
Bond Wire Handling Considerations (IKB-023)
Link
Further Information
What are Thick Film AlN Pastes
Thick film AlN pastes are specialised printable materials designed for use on aluminium nitride (AlN) ceramic substrates in microelectronic and hybrid circuit manufacturing.
These pastes are formulated to be screen printed onto AlN substrates and subsequently fired to create conductive, resistive, dielectric, or protective layers that are permanently bonded to the substrate.
Key characteristics of thick film AlN pastes include:
- Thick film AlN pastes are formulated specifically for aluminium nitride substrates, supporting reliable adhesion and stable film formation on a material with distinct surface chemistry and thermal behaviour.
- These pastes are designed for screen printing, drying, and high‑temperature firing, producing durable conductive, resistive, or insulating layers bonded to the AlN substrate.
- After firing, thick film AlN pastes provide consistent film thickness and stable electrical and mechanical properties, supporting repeatable performance in microelectronic applications.
- Thick film AlN pastes are commonly used in high‑power and thermally demanding applications, including power electronics, microwave devices, and heaters, where efficient heat dissipation and reliability are required.
Inseto Knowledge Base Document:
Read our guide to “Laser Trimming Basics“
Wiki – Thick Film Technology
Applications
Microelectronic Devices, Microwave Devices, Heating Elements, Printable Resistors & Thermistors
Industry Segments
Microelectronic / Hybrid Assembly, Photonic Devices, Microwave Electronics, Automotive Electronics, Wireless Telecommunications, Data Processing, Instrumentation, Military, Consumer Electronics, Industrial Electronics
Koartan Website
Region
Available throughout Europe from Inseto
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