Inseto

Thick Film Gold Conductors

Koartan manufactures a comprehensive range of Gold, Silver, Palladium and Platinum conductive thick-film pastes for a wide variety of Hybrid Microelectronic applications.

AlN Thick Film Inks

What are Thick Film Gold Conductors?

Thick film gold conductors are printable conductive pastes used in the manufacture of hybrid microelectronic circuits and devices.

Formulated with gold as the primary conductive material, these pastes are screen printed onto ceramic substrates such as alumina and aluminium nitride, then fired to form highly conductive, durable metal tracks and features.

Thick film gold conductors are widely used where high electrical conductivity, reliable wire bonding, and long‑term stability are required.

Key Features of Gold Conductive Pastes

  • Suitable for all processes – etchable, solderable, etc.
  • Gold and aluminium wire bondable
  • Wide range of firing temperatures (500 – 1,050ºC)
  • Thinners available for extended working life (information on-demand)

Thick Film Conductive Pastes Resources

Koartan Thick Print Gold Paper – IMAPS2002

Silver-Pt/Pd Thick Film Conductors

About Koartan Gold and Silver Pastes

Their Gold pastes are suitable for high conductivity thick film requirements, on both alumina and aluminium nitride. Included in the portfolio are both wire-bondable and solderable materials, as well as pastes for via plugging or edge coating. Wire-bondable and solderable Gold pastes are also available for low temperature firing applications, starting at 500°C, without any compromise in adhesion. Lead-free and cadmium-free options are also available.

The range of Silver-bearing pastes includes conductor materials, termination metallisation’s, plateable inks, low-temperature firing from 400°C, and also lead- & cadmium-free materials.

Koartan also offers combinations of Silver Palladium and Silver Platinum with a wide range of properties: high leach resistance, excellent solder acceptance, and some lead-free and cadmium-free products.

Key Characteristics of Thick Film Gold Conductors

  • Thick film gold conductors offer reliable electrical conductivity after firing, with stable long‑term performance. Gold’s resistance to oxidation and corrosion makes them suitable for demanding and long‑life applications.
  • Thick film gold conductors are compatible with wire bonding, particularly gold and aluminium wire bonding. This makes them well suited to hybrid microelectronic circuits requiring robust and repeatable interconnections.
  • These conductors are printable pastes applied by screen printing to ceramic substrates and fired at high temperatures. Firing bonds the gold to the substrate, forming durable conductive tracks several microns thick.
  • Gold‑based thick film conductors are commonly used in high‑reliability environments involving thermal cycling, humidity, or chemical exposure, supporting applications in aerospace, military, medical, and high‑frequency electronics.
Microelectronic Thick Film AIN Pastes

Got a Question About Thick Film Gold Conductors?

Whether you’re developing a new product or refining an existing process, Inseto’s team of experts is here to help.

From selecting the right thick film gold conductor to optimising your processes, we provide technical guidance, documentation, samples and on-site training to support your application needs.

Gold Thick Film Conductor Product Range

Part# 4000

Type

Repair, plug

Description

100% gold paste, for track repair on hybrids, can also plug pin-holes, fires at 850ºC

Part# 4100

Type

Au bondable

Description

Spherical gold particles for excellent edge definition, fires at 850ºC

Part# 4101

Type

Au Via Fill

Description

Gold via fill conductor for small & large via holes, fires at 850ºC

Part# 4129

Type

Au & Al bondable

Description

Cd & Pb Free for fine line printing, fires at 850ºC

Part# 4150QJ

Type

Au bondable

Description

High electrical conductivity, fine line printing, fires at 850ºC

Part# 4171

Type

Au bondable

Description

Good line resolution, straight edges, smooth surface, ideal for RF applications, fires at 850ºC

Part# 4225

Type

Al bondable

Description

Designed for heavy aluminium wire bonding, also suitable for gold wire bonding, fires at 850ºC

Part# 4496

Type

Solderable

Description

Top-layer solderable gold with excellent leach resistance and aged adhesion, fires at 850ºC

Part# 4505

Type

Au bondable

Description

Low temperature, suitable for glass circuits & resistor CCT repair, fires at 500°C

Part# 4530

Type

Pull-thru

Description

High binders for pull-thru & edge painting, low ESR, fires at 850ºC

Part# 4541

Type

Plug

Description

Very high solids paste for plugging holes in the substrate, fires at 850ºC

Part# 4550

Type

Etchable

Description

Etchable gold with excellent fired density, wire bondable, suitable for RF, fires at 850ºC

Part# 4583

Type

Solderable

Description

Ultra thin-print, laser trimable, fires up to 1050°C

Part# 4586

Type

Solderable

Description

Thin-printing, economical solderable gold, fires at 850ºC

Part# 4906

Type

AIN Gold

Description

Low temperature gold for AlN, fires at 600ºC

Knowledge Base Articles

Related Products

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.com

Wiki – Thick Film Technology

Thick Film Technology – Wikipedia

Applications

Microelectronic Devices, Microwave Devices, Heating Elements, Printable Resistors & Thermistors

Industry Segments

Microelectronic / Hybrid Assembly, Photonic Devices, Microwave Electronics, Automotive Electronics, Wireless Telecommunications, Data Processing, Instrumentation, Military, Consumer Electronics, Industrial Electronics

Region

Available throughout Europe from Inseto

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