Thick Film Gold Conductors
Gold Conductive Pastes Key Features
- Suitable for all processes – etchable, solderable, etc.
- Gold and aluminium wire bondable
- Wide range of firing temperatures (500 – 1,050ºC)
- Thinners available for extended working life (information on-demand)
Koartan manufactures a comprehensive range of Gold, Silver, Palladium and Platinum conductive thick-film pastes for a wide variety of Hybrid Microelectronic applications.
Their Gold pastes are suitable for high conductivity thick film requirements, on both alumina and aluminium nitride. Included in the portfolio are both wire-bondable and solderable materials, as well as pastes for via plugging or edge coating. Wire-bondable and solderable Gold pastes are also available for low temperature firing applications, starting at 500°C, without any compromise in adhesion. Lead-free and cadmium-free options are also available.
The range of Silver-bearing pastes includes conductor materials, termination metallisation’s, plateable inks, low-temperature firing from 400°C, and also lead- & cadmium-free materials.
Koartan also offers combinations of Silver Palladium and Silver Platinum with a wide range of properties: high leach resistance, excellent solder acceptance, and some lead-free and cadmium-free products.
Thick Film Conductive Pastes Technical Downloads
File
Koartan Thick Print Gold Paper – IMAPS2002
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Gold Thick Film Conductor Product Range
Part#
Type
Description
Part#
4000
Type
Repair, plug
Description
100% gold paste, for track repair on hybrids, can also plug pin-holes, fires at 850ºC
Download
Part#
4100
Type
Au bondable
Description
Spherical gold particles for excellent edge definition, fires at 850ºC
Download
Part#
4101
Type
Au Via Fill
Description
Gold via fill conductor for small & large via holes, fires at 850ºC
Download
Part#
4129
Type
Au & Al bondable
Description
Cd & Pb Free for fine line printing, fires at 850ºC
Download
Part#
4150QJ
Type
Au bondable
Description
High electrical conductivity, fine line printing, fires at 850ºC
Download
Part#
4171
Type
Au bondable
Description
Good line resolution, straight edges, smooth surface, ideal for RF applications, fires at 850ºC
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Part#
4225
Type
Al bondable
Description
Designed for heavy aluminium wire bonding, also suitable for gold wire bonding, fires at 850ºC
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Part#
4496
Type
Solderable
Description
Top-layer solderable gold with excellent leach resistance and aged adhesion, fires at 850ºC
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Part#
4505
Type
Au bondable
Description
Low temperature, suitable for glass circuits & resistor CCT repair, fires at 500°C
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Part#
4530
Type
Pull-thru
Description
High binders for pull-thru & edge painting, low ESR, fires at 850ºC
Download
Part#
4541
Type
Plug
Description
Very high solids paste for plugging holes in the substrate, fires at 850ºC
Download
Part#
4550
Type
Etchable
Description
Etchable gold with excellent fired density, wire bondable, suitable for RF, fires at 850ºC
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Part#
4583
Type
Solderable
Description
Ultra thin-print, laser trimable, fires up to 1050°C
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Part#
4586
Type
Solderable
Description
Thin-printing, economical solderable gold, fires at 850ºC
Download
Part#
4906
Type
AlN gold
Description
Low temperature gold for AlN, fires at 600ºC
Download
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Knowledge Base Articles
Description
Description
Laser Trimming Basics (IKB-052)
Link
Description
Adhesives for Die Attach (IKB-071)
Link
Description
Die Attach Process: Guidance and Setup (IKB-072)
Link
Description
Bonding Wire Sizes & Selection (IKB-037)
Link
Description
Bond Wire Handling Considerations (IKB-023)
Link
Further Information
What are Thick Film Gold Conductors
Thick film gold conductors are printable conductive pastes used in the manufacture of hybrid microelectronic circuits and devices.
Formulated with gold as the primary conductive material, these pastes are screen printed onto ceramic substrates such as alumina and aluminium nitride, then fired to form highly conductive, durable metal tracks and features.
Thick film gold conductors are widely used where high electrical conductivity, reliable wire bonding, and long‑term stability are required.
Key characteristics of thick film gold conductors include:
- Thick film gold conductors offer reliable electrical conductivity after firing, with stable long‑term performance. Gold’s resistance to oxidation and corrosion makes them suitable for demanding and long‑life applications.
- Thick film gold conductors are compatible with wire bonding, particularly gold and aluminium wire bonding. This makes them well suited to hybrid microelectronic circuits requiring robust and repeatable interconnections.
- These conductors are printable pastes applied by screen printing to ceramic substrates and fired at high temperatures. Firing bonds the gold to the substrate, forming durable conductive tracks several microns thick.
- Gold‑based thick film conductors are commonly used in high‑reliability environments involving thermal cycling, humidity, or chemical exposure, supporting applications in aerospace, military, medical, and high‑frequency electronics.
Inseto Knowledge Base Document:
Read our guide to “Laser Trimming Basics“
Wiki – Thick Film Technology
Applications
Microelectronic Devices, Microwave Devices, Heating Elements, Printable Resistors & Thermistors
Industry Segments
Microelectronic / Hybrid Assembly, Photonic Devices, Microwave Electronics, Automotive Electronics, Wireless Telecommunications, Data Processing, Instrumentation, Military, Consumer Electronics, Industrial Electronics
Koartan Website
Region
Available throughout Europe from Inseto
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