Thick Film Silver-Pt/Pd Conductors
Silver-Pt/Pd Conductive Pastes Key Features
- High leach resistance
- Excellent solder resistance
- Pb-free and Cd-free versions also available
- Wide range of firing temperatures (450 – 850ºC)
Koartan manufactures a comprehensive range of Silver-Platinum, Silver-Palladium, Gold & Silver conductive thick-film pastes for a wide variety of Microelectronic Hybrid applications.
Koartan offers combinations of Silver Palladium and Silver Platinum with a range of properties: high leach resistance, excellent solder acceptance, and some lead-free and cadmium-free products.
The range of Silver-bearing pastes includes conductor materials, termination metallisation’s, plateable inks, low-temperature firing from 400°C, and also lead- & cadmium-free materials.
Gold pastes from Koartan are suitable for high conductivity thick film requirements, on both alumina and aluminium nitride. Included in the portfolio are both wire-bondable and solderable materials, as well as pastes for via plugging or edge coating. Wire-bondable and solderable Gold pastes are also available for low temperature firing applications, starting at 500°C, without any compromise in adhesion. Lead-free and cadmium-free options are also available.
Thick Film Conductive Pastes Technical Downloads
File
Koartan Thick Print Gold Paper – IMAPS2002
Download
Silver Palladium & Platinum Thick Film Conductor Product Range
Part#
Type
Description
Part#
6225
Type
Solderable
Description
High Palladium content, excellent leach & silver migration resistance, fires at 850ºC
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Part#
6229
Type
Solderable
Description
Low cost, low resistivity, plateable conductor, fires at 850ºC
Download
Part#
6231
Type
High Pd Content
Description
Solderable, excellent leach resistance and adhesion, fires at 850ºC
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Part#
6241
Type
Medium Pd Content
Description
Excellent solder & leach resistance acceptance, used in fuel sender applications, fires at 850ºC
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Part#
6250-1 / 2
Type
Two Options
Description
Low & high viscosity for the coating of very small holes & castellation’s, fires at 850ºC
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Part#
6261
Type
Mid-Price
Description
Excellent solder adhesion, for industrial & automotive applications, fires at 850ºC
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Part#
6291
Type
High Performance
Description
Low resistivity, moderate cost, excellent solder acceptance & leach resistance, fires at 850ºC
Download
Part#
6292
Type
AlN AgPd
Description
High adhesion silver-palladium conductor for AlN, fires at 850ºC
Download
Part#
6296
Type
AgPd nano
Description
Nano particle-filled for solder-promoting, fires at 580 – 620ºC
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Part#
6305
Type
AgPt
Description
Excellent solder acceptance and leach resistance, fires at 850ºC
Download
Part#
6333
Type
AgPt
Description
Low cost, excellent solder acceptance and leach resistance, fires at 850ºC
Download
Part#
6410
Type
AgPtPd
Description
For low temperature resistive elements, economical conductor, fires at 850ºC
Download
Part#
6493
Type
AgPtPd
Description
For very demanding solder leach resistance requirements, fires at 850ºC
Download
Part#
6540
Type
Plug
Description
Very high solids paste for plugging holes in the substrate, fires at 850ºC
Download
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Knowledge Base Articles
Description
Description
Laser Trimming Basics (IKB-052)
Link
Description
Adhesives for Die Attach (IKB-071)
Link
Description
Die Attach Process: Guidance and Setup (IKB-072)
Link
Description
Bonding Wire Sizes & Selection (IKB-037)
Link
Description
Bond Wire Handling Considerations (IKB-023)
Link
Further Information
What are Thick Film Silver‑Platinum‑Palladium Conductors
Thick film silver‑platinum‑palladium conductors are composite conductive pastes used in thick film and hybrid microelectronic circuits where improved stability and reliability are required compared with pure silver systems.
Deposited by screen printing onto ceramic substrates and fired at high temperature, these materials form conductive films that combine the high conductivity of silver with the enhanced thermal and chemical stability provided by platinum and palladium.
Key characteristics of thick film silver-Platinum-Palladium conductors include:
- Silver‑platinum‑palladium conductors balance good electrical conductivity with improved thermal and chemical stability compared with pure silver systems.
- The inclusion of platinum and palladium reduces silver migration, improving reliability in humid or high‑reliability environments.
- These materials are screen printed and fired to form dense, adherent conductive films on ceramic substrates.
- Ag‑Pt‑Pd conductors are commonly used where stable, solderable pads and terminations are required, offering better solder leach resistance than pure silver films.
Inseto Knowledge Base Document:
Read our guide to “Laser Trimming Basics“
Wiki – Thick Film Technology
Applications
Microelectronic Devices, Microwave Devices, Heating Elements, Printable Resistors & Thermistors
Industry Segments
Microelectronic / Hybrid Assembly, Photonic Devices, Microwave Electronics, Automotive Electronics, Wireless Telecommunications, Data Processing, Instrumentation, Military, Consumer Electronics, Industrial Electronics
Koartan Website
Region
Available throughout Europe from Inseto
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