Applied Thin-Film Products – Design Guidelines
To simplify the process as much as possible, ATP offers design guidelines on a range of topics. Information on their standard manufacturing dimensions and tolerances can help at the very early stages of the customer design, knowing what is achievable using standard materials processes and thereby minimising costs. Detailed CAD pointers allow customer designs to be imported directly into ATP’s in-house CAD system.
ATP’s thin film design rules contain the fundamental design rules that must be followed in order for the product to be compatible with ATP’s processing techniques. ATP also offers customer assistance by defining the design rules for laser trimming TaN resistors on thin film circuits.
As a reference to the thermal performance of TaN resistors, ATP has produced data that gives the circuit designer an insight into the surface temperature distribution both through an alumina substrate and across a square resistor. In addition, a series of equations is available that investigates the aging equation of TaN resistors.
Just as with TaN resistors, ATP offers similar assistance when working with Polyimide bridges, with a complete set of design rules available for the design stage of the circuit.
For aluminium nitride substrates, thermal dissipation is rarely an issue! However, this is not always the case with alumina substrates. Track width and thickness assume much greater importance for alumina, and so ATP offers information on safe current limits for both gold and copper tracks on alumina substrates, assisting the designer in choosing a safe bias current level.
ATP Thin Film Circuits Design Rules
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Standard Dimensions and Tolerances
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CAD Data Guidelines
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File
Thin Film Circuit Design Rules
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File
Laser Resistor Trimming Design Rules
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File
TaN Resistors – Thermal Performance and Aging
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File
Polyimide Bridge Design Rules
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File
Safe Current Limits Guidelines
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Die Attach Adhesives
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Bonding Wire & Ribbon
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RF & Microwave Packages
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Optoelectronic Packages
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Knowledge Base Articles
Description
Description
Laser Trimming Basics (IKB-052)
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Description
Adhesives for Die Attach (IKB071)
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Die Attach Process: Guidance and Setup (IKB-072)
Link
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Bonding Wire Sizes & Selection (IKB-037)
Link
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Bond Wire Handling Considerations (IKB-023)
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Fine Ribbon Bonding Wedge (IKB-066)
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Further Information
What are ATP’s Thin Film Circuit Design Guidelines
ATP’s Thin Film Circuit Design Guidelines are a set of technical design rules and reference information intended to support the development of thin film and metalised substrate circuits that are compatible with ATP’s manufacturing processes.
They provide designers with early‑stage guidance on standard dimensions, tolerances and achievable features, helping to minimise cost and design revisions.
The guidelines also include CAD requirements, processing constraints and specific design rules for elements such as tantalum nitride resistors, polyimide bridges and current‑carrying tracks, ensuring reliable electrical and thermal performance in demanding microelectronic, RF and photonic applications.
Key Thin Film Circuit Design Considerations include:
- Early consideration of achievable dimensions and tolerances helps improve manufacturability, yield and overall cost control.
- Well‑organised CAD data and consistent design rules support accurate translation from design to manufacture and reduce the risk of interpretation errors.
- Resistors, bridges and interconnect features should be designed with predictable electrical, thermal and long‑term stability in mind.
- Conductor geometry, material choice and substrate properties should be matched to expected current levels and thermal loads to ensure reliable operation.
Inseto Knowledge Base Document:
Read our guide to “What is Microelectronics Assembly”
Wiki – Thin Film
Applications
Thin Film Substrates, Thin Film Metalised Blocks, Thin Film Devices, Laser Diode Sub Mounts, Photodiode Mounts, Chip Mounts, Wire Bond Standoffs, Cooler Spacers, Ceramic Spacers, Microwave Metalized Circuits, RF Circuits, High Frequency Devices
Industry Segments
Military & Aerospace, Telecommunications, Fibre Optics, Photonics, Microwave Electronics, Microelectronics, Space & Research, General Power Electronics, Concentrated Photovoltaic (CPV), Military & Aerospace, Avionics, Automotive, Renewable Energy, Mass Transit etc.
ATP Website
Region
Available from Inseto in the United Kingdom, Ireland & Nordic Region
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