Applied Thin-Film Products – Components
ATP offers an assortment of products for different applications. These include inductor coils that have been modelled and optimised using advanced CAD tools to produce data and graphs to help engineers utilise these devices in their own thin-film or hybrid designs. These printed inductors can be used in a wide variety of applications from DC and RF filtering to gain shaping and equalisation circuits. Engineering kits are available which contain the entire product line in one complete package to meet all prototyping needs.
ATP also offers three different types of 50Ω transmission lines: single line, single line with two rows of tuning pads, and single line with four rows of tuning pads. ATP Transmission Lines have a fixed width and adjustable lengths, and no mask purchase is required. Lines are continuous and can therefore be diced to any size. In-stock lengths are in 0.010″ (0.254mm) increments, up to 0.500″ (12.70mm). There is no pull-back in the design, so parts may occasionally have burrs / tails since dicing is carried out through the gold. Engineering kits are also available.
Stand-offs & Isolation Pads can be used as a capacitive standoff, component mounting isolation pad, landing pads to reduce bond wire and DC bias wire lengths, gap pedestals for aligning component heights, and many other useful configurations. There is no pull-back in the design, so parts may occasionally have burrs / tails since dicing is carried out through the gold.
Bond pad test coupons are a platform that allows for organising and tracking wirebond pull data on a daily and monthly basis. The coupon is designed as a calendar to maintain daily & monthly test results of each wirebonder on the assembly line. Each pad maintains the bond pulls done on a daily basis, allowing a new set of bonds to be added each day throughout the month. The coupon offers the ability to mark or scribe specific information on it such as the month samples are from and which wirebonder they were performed on.
Surface finish and bond strength are key attributes of good quality metalisation. ATP offers the opportunity to evaluate a wide range of metalisation schemes on different substrate materials so that customers can see in advance the quality of the product on offer from ATP.
ATP offers a range of thin-film resistors and resistor networks as stand-alone products, forming an integrated solution for RF circuits and Optical carriers. Multiple values are available, including ladder and multi-tap configurations, suitable for most engineering and production application needs.
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Knowledge Base Articles
Description
Description
Laser Trimming Basics (IKB-052)
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Description
Adhesives for Die Attach (IKB071)
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Die Attach Process: Guidance and Setup (IKB-072)
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Bonding Wire Sizes & Selection (IKB-037)
Link
Description
Bond Wire Handling Considerations (IKB-023)
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Fine Ribbon Bonding Wedge (IKB-066)
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Further Information
What are ATP’s Thin Film Products
ATP’s thin film products are a range of precision‑engineered metalised substrates and microelectronic components manufactured using advanced thin film processing techniques.
These products include thin film substrates, metalised blocks and functional thin film devices designed to provide stable electrical, thermal and mechanical performance in demanding applications.
ATP products support complex circuit integration, including resistive, conductive and interconnect features, and are commonly used in RF, microwave, photonic and high‑reliability electronic systems where consistency, miniaturisation and performance repeatability are critical.
Key ATP Thin Film product types include:
- Precision ceramic substrates with deposited thin film metallisation for RF, microwave and photonic circuits.
- Functional devices including thin film resistors, resistor networks and integrated circuit elements.
- Printed inductors and 50 Ω transmission line products supplied as standard items or engineering kits.
- Metalised pads and structures for component mounting, isolation, height control and bond testing.
- Pre‑configured product kits that support prototyping, tuning and design validation.
Inseto Knowledge Base Document:
Read our guide to “What is Microelectronics Assembly”
Wiki – Thin Film
Applications
Thin Film Substrates, Thin Film Metalised Blocks, Thin Film Devices, Laser Diode Sub Mounts, Photodiode Mounts, Chip Mounts, Wire Bond Standoffs, Cooler Spacers, Ceramic Spacers, Microwave Metalized Circuits, RF Circuits, High Frequency Devices
Industry Segments
Military & Aerospace, Telecommunications, Fibre Optics, Photonics, Microwave Electronics, Microelectronics, Space & Research, General Power Electronics, Concentrated Photovoltaic (CPV), Military & Aerospace, Avionics, Automotive, Renewable Energy, Mass Transit etc.
ATP Website
Region
Available from Inseto in the United Kingdom, Ireland & Nordic Region
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