Applied Thin-Film Products – Technology Overview
ATP’s technological capabilities include Polyimide-supported bridges, solder dams, laser diode sub-mounts, plated and solid-filled Vias, edge wraps, and gold bumps.
Polyimide bridges provide a dramatically improved alternative to traditional wire bonding or standard air bridges. Because bridge height, length and overall placement are very consistent and durable, optimum performance can be easily repeated which can minimise or eliminate test and tune time. Typical bridge height is 3 – 6µm.
ATP offers photo-definable Polyimide and Metal solder dams. Polyimide is non-conductive. Typical metals include TaN, TiW, Ni & Pd.
ATP custom fabricates thin-film sub-mounts with tightly controlled substrate and metal thicknesses, with pre-deposited and patterned AuSn, on highly thermally conductive AlN. The AuSn can be either sputtered or plated. Four standard test profiles are available in order to match as closely as possible the customer’s assembly process.
Via holes through the substrate material allow for connections between the top and bottom surfaces, allowing for a convenient means of obtaining a ground return through the substrate. Assembly concerns are addressed by eliminating epoxy and solder bleed onto the surfaces with either Polyimide or solid-filled Vias. Solid-filled Vias provide a low inductance ground path on both sides. Filled Vias can also act as a thermal pathway for two-sided signal interconnects.
Edge metalisation can be an alternative to Vias or slotted wraps. Edge-defined and indented edge wraps can be photo-definable.
ATP provides gold bumping for Flip Chip Assembly. These offer improved electrical performance at higher frequencies by inverting a compatible device directly onto the gold bumps. The bumps are a high-purity plated gold, made using a photolithographic process that ensures precise, repeatable placement onto the circuit.
Related Products
Solder Preforms & Ribbon
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Die Attach Adhesives
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Bonding Wire & Ribbon
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RF & Microwave Packages
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Optoelectronic Packages
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Knowledge Base Articles
Description
Description
Laser Trimming Basics (IKB-052)
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Description
Adhesives for Die Attach (IKB071)
Link
Description
Die Attach Process: Guidance and Setup (IKB-072)
Link
Description
Bonding Wire Sizes & Selection (IKB-037)
Link
Description
Bond Wire Handling Considerations (IKB-023)
Link
Description
Fine Ribbon Bonding Wedge (IKB-066)
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Further Information
What are ATP’s Thin Film Substrates
ATP’s thin film substrates are precision engineered ceramic substrates that incorporate highly controlled thin film metal layers to support advanced microelectronic, RF, microwave and photonic applications.
Manufactured using specialist thin film processes, these substrates provide repeatable electrical, thermal and mechanical performance for demanding, high reliability environments.
ATP’s capabilities include complex metallisation schemes, integrated features such as vias, edge wraps and polyimide supported bridges, and tightly controlled substrate and metal thicknesses to meet exacting design requirements.
Key ATP Thin Film Substrate technologies include:
- High precision thin film processing that deliver consistent conductor geometry and repeatable electrical performance, supporting complex circuit designs.
- Substrates can include vias, edge metallisation, polyimide supported bridges and gold bumping to enable compact, reliable interconnection.
- Ceramic substrates combined with optimised metal systems provide stable thermal conductivity and electrical behaviour for demanding applications.
- Custom build‑to‑specification capability with materials, thicknesses and metallisation schemes tailored to meet the requirements of high reliability sectors such as aerospace, defence and photonics.
Inseto Knowledge Base Document:
Read our guide to “What is Microelectronics Assembly”
Wiki – Thin Film
Applications
Thin Film Substrates, Thin Film Metalised Blocks, Thin Film Devices, Laser Diode Sub Mounts, Photodiode Mounts, Chip Mounts, Wire Bond Standoffs, Cooler Spacers, Ceramic Spacers, Microwave Metalized Circuits, RF Circuits, High Frequency Devices
Industry Segments
Military & Aerospace, Telecommunications, Fibre Optics, Photonics, Microwave Electronics, Microelectronics, Space & Research, General Power Electronics, Concentrated Photovoltaic (CPV), Military & Aerospace, Avionics, Automotive, Renewable Energy, Mass Transit etc.
ATP Website
Region
Available from Inseto in the United Kingdom, Ireland & Nordic Region
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