Applied Thin-Film Products – An Overview
Founded over 30 years ago, ATP offers state-of-the-art thin film circuit processing. Operating out of multiple cleanrooms in the heart of Silicon Valley, ATP delivers superior products with punctual delivery and competitive pricing. Certified to ISO 9001:2015 and AS9100D, all products are manufactured to the exacting standards of MIl-STD-883. Product screening to MIL-PRF-38534 is available on demand. In-house test capabilities include bond pull, die shear, component burn-in, SEM analysis, temperature cycling, etc.
ATP offers build-to-print services for a wide range of materials and metalisation schemes. Substrate materials include As-Fired Alumina, Polished Alumina, Superstrate TPS, Aluminium Nitride, Fused Silica/Quartz, Sapphire and Hi-K Dielectrics. Technical data and substrate stock information are available in the Download section.
Metalisations range from standard films to Aluminium, Chrome, Copper, Nickel, Gold, Palladium, Platinum, Titanium and Titanium Tungsten.
Products are manufactured to customer requirements for applications that include RF, microwave & millimetre wave, fibre-optic, and hi-rel products. Markets include wireless communications, defence, aerospace and satellite communications, medical electronics, and the fibre-optic industry.
ATP General Information Downloads
File
ATP ISO9001:2015 & AS9100D Certificate
Download
File
Material Specifications
Download
File
Substrate Stock
Download
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Die Attach Adhesives
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Knowledge Base Articles
Description
Description
Laser Trimming Basics (IKB-052)
Link
Description
Adhesives for Die Attach (IKB071)
Link
Description
Die Attach Process: Guidance and Setup (IKB-072)
Link
Description
Bonding Wire Sizes & Selection (IKB-037)
Link
Description
Bond Wire Handling Considerations (IKB-023)
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Fine Ribbon Bonding Wedge (IKB-066)
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Further Information
What are Custom Thin Film Circuits
Custom thin film circuits are build‑to‑print microelectronic circuits produced to individual customer specifications, combining selected substrate materials, metallisation systems and circuit features into a single, application‑ready solution.
Rather than standard product formats, these circuits are designed around the electrical, thermal and mechanical requirements of the end use, allowing optimisation for factors such as frequency performance, power handling, reliability and package integration.
They are typically specified where off‑the‑shelf thin film products cannot meet performance or form‑factor requirements, and are used in demanding RF, microwave, photonic and high‑reliability electronic systems across aerospace, defence, communications and advanced industrial applications.
Key ATP Thin Film Circuit capabilities include:
- Precision ceramic substrates with deposited thin film metallisation for RF, microwave and photonic circuits.
- Functional devices including thin film resistors, resistor networks and integrated circuit elements.
- Printed inductors and 50 Ω transmission line products supplied as standard items or engineering kits.
- Metalised pads and structures for component mounting, isolation, height control and bond testing.
- Pre‑configured product kits that support prototyping, tuning and design validation.
Inseto Knowledge Base Document:
Read our guide to “What is Microelectronics Assembly”
Wiki – Thin Film
Applications
Thin Film Substrates, Thin Film Metalised Blocks, Thin Film Devices, Laser Diode Sub Mounts, Photodiode Mounts, Chip Mounts, Wire Bond Standoffs, Cooler Spacers, Ceramic Spacers, Microwave Metalized Circuits, RF Circuits, High Frequency Devices
Industry Segments
Military & Aerospace, Telecommunications, Fibre Optics, Photonics, Microwave Electronics, Microelectronics, Space & Research, General Power Electronics, Concentrated Photovoltaic (CPV), Military & Aerospace, Avionics, Automotive, Renewable Energy, Mass Transit etc.
ATP Website
Region
Available from Inseto in the United Kingdom, Ireland & Nordic Region
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