uGALV Wet Bench Plating Equipment

The electroforming unit μGalv is an advanced wet bench plating tool enabling plating applications in a range of industries: MEMS, semiconductor, optical and photovoltaics. The ideal tool either for industrial or R&D demands due to the flexible arrangement and build-up of the processes including process ramp-up. The μGalv plating system is available as either the μGalv-W for wafer processing and the μGalv-P for the processing of larger panels. These systems are suitable for wafer sizes up to 300 mm and panels up to Gen 5.1.

The MOT team additionally offers customised wet bench plating solutions tailored to the specific technical details of your process. The applications lab in Germany has all necessary tools to process wafers, measure results and optimise the configuration to help select chemistries and advise you on the options available each step of the way.

The μGalv plating systems are used for a variety of applications from pad, contact and pillar forming, redistribution layer (RDL) and through silicon via (TSV) fills as well as wafer chip scale packaging. The equipment is based on a white polypropylene (PP) with transparent PVC doors and plumbing from PP, PVDF or PFA. The centrifugal pump is PP as standard or optionally PVDF or PTFE.

The μGalv allows the operator to run the electroplating process automatically with parameters such as pH, Temperature and flow rate controlled by the software. Electroplating of a wide range of metals including Au, Ni, Cu, In, Sn, SPb, SnAg, NiFe, NiCo, & NiW are all possible.

A variety of general options are available alongside more customer specific configurations. These general options include, Automatic Handling (Semi Auto, Dry in – out); Integration of pre/post process cells and of Laminar-Flow-Units; Etching and Wetting Cells available.